液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
矽型 · 導熱材料 ——
CATEGORY
FEATURES
/ Lightweight, Low Density Thermal Conductivity: 4.0 W/m*K
/ High flow rate, extrusion rate under 90psi&60s conditions:56 g/min
/ Bond line thickness:100-1500µm
/ Designed to remove manufacturing tolerances
/ Does not produce stress on delicate components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression and low stress application
VERTICAL RELIABILITY
Using 1.5mm pad as a gap control, put the putty between the aluminum and the glass panel mark the initial position. Then, place it in the oven with 125℃ for 1,000 hours and observe its displacement after reliability test
TYPICAL APPLICATION
/ lightweight applications, such as Automotive electronic devices, Mobile communication device, Drone & aircraft, Sports and leisure electronic products, Portable computers and tablets, wearable devices, Portable game consoles, VR devices and etc.
TYPICAL PROPERTIES
| PROPERTY | DTT04-s | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Yellow | - | Visual |
| Resin base | Silicone | - | - |
| Viscosity | 1000 | Pa.s | DIN 53018 |
| Flow Rate | 56 | g/min | By LiPOLY |
| Density | 2.3 | g/cm³ | ASTM D792 |
| Application temperature | -60~150 | °C | - |
| Bond line thickness | 100~1500 | μm | - |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 4.0 | W/m*K | ASTM D5470 |
| Thermal impedance@10psi / 60°C | 0.084 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@30psi / 60°C | 0.078 | °C-in²/ W | ASTM D5470 |
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