液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
非矽型 · 導熱材料 ——
N700A-s
2.5 W/m·K
Low Outgassing
在現代電子設備的熱管理領域中，無矽導熱墊片有效解決了傳統矽基材料可能導致的低分子矽氧烷（LMS）揮發問題，從而避免了對精密電子和光學元件的潛在污染與電氣接觸失效，顯著提升了設備的長期可靠性與性能穩定性。LiPOLY® 可即時提供尖端的發熱解決方案，以滿足客戶在面對今日先進產品上特殊的需求。
CATEGORY
FEATURES
/ Thermal conductivity: 2.5 W/m*K
/ It’s made by non-silicone resin materials
/ Low contact thermal resistance
/ With electrical insulation
/ Outstanding thermal conductivity
/ Applicable to optical and sensitive electric components
SPECIFICATIONS
/ Sheet form
/ Die-cut parts
TYPICAL APPLICATION
/ HDDS
/ Optical appliance
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | N700A-s | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Gray | - | Visual |
| Surface tack 2-side/1-side | 2 | - | - |
| Thickness | Customized | mm | ASTM D374 |
| Density | 2.4 | g/cm³ | ASTM D792 |
| Hardness | 60 | Shore OO | ASTM D2240 |
| Tensile Strength | 1.0 | Kgf/cm² | ASTM D412 |
| Outgassing CVCM (wt%) | 0.0079 | - | By LiPOLY |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 2.5 | W/m*K | ASTM D5470 |
| Thermal impedance@10 psi | 0.841 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@50 psi | 0.217 | °C-in²/ W | ASTM D5470 |
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