RBA ∣ ISO14001
∣
ISO/TS16949 ∣ IECQ080000
∣
ISO9001 ∣ UL
∣
View all
Top selling
products
智能機-合體-650x650.webp "N-putty2-s N-putty2-s 是具有熱傳導係數：5.0W/m*K的非矽型導熱凝膠，無低分子矽氧烷揮發，不會造成電器接點故障，適合光學產品或敏感的電子原件使用，極低的熱阻值及低應力，可靈活性的適配間隙，兼具公差補償特性，可以克服類似導熱膏溢流、乾凅問題，可以搭配LiPOLY之putty專用智能機，自動化點膠作業生產的理想選擇。")
Liquid Gap Filler
液体
導熱介面材料
導熱膏
導熱膠泥
導熱填縫膠
導熱灌封膠
Solid GAP Filler
固態
導熱介面材料
導熱石墨系列
導熱墊片系列
超軟導熱墊片
導熱絕緣系列
導熱膠帶系列
導熱吸波系列
導熱低密度系列
斷熱材料系列
| W/m*K | Solid Gap Pad | Liquid Gap Filler | Thermal Absorber | Thermal Tape | Thermal Insulated | Thermal Break | Thermal Lightweight | W/m*K |
| 0.009 | AS27-s | 0.009 | ||||||
| 0.028 | AS17-s | 0.028 | ||||||
| 0.55 | TPS31 | 0.55 | ||||||
| 0.8 | TPS589 | 0.8 | ||||||
| 0.9 | AT900A | 0.9 | ||||||
| 1.0 | AT910 | 1.0 | ||||||
| 1.2 | AT900C | 1.2 | ||||||
| 1.3 | 1.3 | |||||||
| 1.5 | TPS586 | SH1500 | TPS32 | 1.5 | ||||
| 1.8 | ST6000-S | PR27 | 1.8 | |||||
| 2.0 | SH2000 | 2.0 | ||||||
| 2.2 | S393 | 2.2 | ||||||
| 2.5 | EP770-s | 2.5 | ||||||
| 3.0 | SH3000 | DTT44-s | 3.0 | |||||
| 3.2 | S818 | 3.2 | ||||||
| 3.5 | AT920-s | 3.5 | ||||||
| 3.6 | PK404DM | 3.6 | ||||||
| 4.0 | TIM14 | 4.0 | ||||||
| 4.5 | AS02-s | DCTP140-s | 4.5 | |||||
| 5.0 | DTT65-s | 5.0 | ||||||
| 6.0 | PK605 | 6.0 | ||||||
| 7.0 | 7.0 | |||||||
| 8.0 | T-top81-s | SH-putty3 | 8.0 | |||||
| 9.0 | N800A-s | N-putty5-s | 9.0 | |||||
| 10.0 | S-putty5-s | 10.0 | ||||||
| 11.0 | 11.0 | |||||||
| 13.0 | DTT13-s | DTT13-s | 13.0 | |||||
| 15.0 | 15.0 | |||||||
| 17.0 | N800C-s | 17.0 | ||||||
| 18.0 | T-top98-s | 18.0 | ||||||
| 20.0 | T-work9000 | 20.0 | ||||||
| 24.0 | T-top99-s | 24.0 |
| W/m*K | Solid Gap Pad | Liquid Gap Filler | Thermal Absorber | Thermal Tape | Thermal Insulated | Thermal Break | Thermal Lightweight | W/m*K |
| W/m*K | Solid Gap Pad | Liquid Gap Filler | Thermal Absorber | Thermal Tape | Thermal Insulated | Thermal Break | Thermal Lightweight | W/m*K |
For all informaton you need
CALL US: 03-3788588
Silicone
矽型
