RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
N700A-s
2.5 W/m*K
Low Outgassing
In the field of thermal management for modern electronic devices, silicone-free thermal pads effectively solve the low molecular weight siloxane (LMS) outgassing issues that traditional silicone-based materials may cause, thereby preventing potential contamination of precision electronic and optical components and electrical contact failures, significantly enhancing long-term reliability and performance stability of equipment.

CATEGORY

FEATURES

/ Thermal conductivity: 2.5 W/m*K
/ It’s made by non-silicone resin materials
/ Low contact thermal resistance
/ With electrical insulation
/ Outstanding thermal conductivity
/ Applicable to optical and sensitive electric components

SPECIFICATIONS

/ Sheet form
/ Die-cut parts

TYPICAL APPLICATION

/ HDDS
/ Optical appliance
/ 5G base station & infrastructure
/ EV electric vehicle

TYPICAL PROPERTIES

PROPERTY N700A-s UNIT TEST METHOD
Color Gray - Visual
Surface tack 2-side/1-side 2 - -
Thickness Customized mm ASTM D374
Density 2.4 g/cm³ ASTM D792
Hardness 60 Shore OO ASTM D2240
Tensile Strength 1.0 Kgf/cm² ASTM D412
Outgassing CVCM (wt%) 0.0079 - By LiPOLY
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 2.5 W/m*K ASTM D5470
Thermal impedance@10 psi 0.841 °C-in²/ W ASTM D5470
Thermal impedance@50 psi 0.217 °C-in²/ W ASTM D5470

Related​ Product

N700A-s
2.5 W/m*K
Low Outgassing

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    熱介面管理專家

    LiPOLY® Advance TIMs

    桃園市八德區永豐路435號

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