N800CH-s
15.0 W/m*K
Low Outgassing
液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
非矽型 · 導熱材料 ——
N800BH-s
11.0 W/m*K
Low Outgassing
N800BH-s採用非矽型樹脂材料作成，無低分子矽氧烷揮發，不會造成電器接點故障，適合光學產品或敏感的電子原件使用。熱傳導係數：11.0 W / m*K的間隙填充材料。硬度Shore OO/50具有良好的導熱性，呈現出最低的熱阻值，尤其是N800C-s熱傳導係數高達17.0 W / m*K。旭立專業的研發能力，可即時提供尖端的發熱解決方案，以滿足客戶在面對今日先進產品上特殊的需求。
CATEGORY
FEATURES
/ Thermal conductivity:11.0 W/m*K
/ It’s made by non-silicone resin materials
/ Low contact thermal resistance
/ With electrical insulation
/ Outstanding thermal conductivity
/ Applicable to optical and sensitive electric components
SPECIFICATIONS
/ Sheet form
/ Die-cut parts
TYPICAL APPLICATION
/ HDDS
/ Optical appliance
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | N800BH-s | TEST METHOD | UNIT |
|---|---|---|---|
| Color | Pink | Visual | - |
| Surface tack 2-side/1-side | 2 | - | - |
| Thickness | Customized | ASTM D374 | mm |
| Density | 3.3 | ASTM D792 | g/cm³ |
| Hardness | 50 | ASTM D2240 | Shore OO |
| Tensile Strength | 0.15 | ASTM D412 | Kgf/cm² |
| Outgassing CVCM (wt%) | 0.0047 | By LiPOLY | - |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 11.0 | ASTM D5470 | W/m*K |
| Thermal impedance@10 psi | 0.210 | ASTM D5470 | °C-in²/ W |
| Thermal impedance@30 psi | 0.088 | ASTM D5470 | °C-in²/ W |
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