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SP-23
0.8 W/m·K
TO220 / TO3P
SP-23 Thermal Rubber Cab is a product that combines "high-efficiency heat dissipation" and "electrical insulation" properties, commonly used for electronic components with TO-220, TO-247, TO-3P package forms, or in applications such as power modules, power semiconductors, LED lighting, and automotive electronics to achieve both thermal management and insulation purposes simultaneously.
CATEGORY
FEATURES
/ Thermal conductivity: 0.8 W/m·K
/ Excellent insulator
/ High recovery
/ Easy to assemble
/ Available in a range of thicknesses
CONFIGURATIONS
/ 11.4mm x 16.0mm x 5.8mm
/ 11.4mm x 21.5mm x 5.8mm
/ 17.5mm x 28.5mm x 5.8mm
TYPICAL APPLICATION
/ Between CPU and heat sink
/ Between a component and heat sink
/ Notebook computers
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
TYPICAL PROPERTIES
| PROPERTY | SP-23 | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Gray | - | Visual |
| Resin Base | Silicone | - | - |
| Thickness | 0.3 | 0.45 | mm | ASTM D374 |
| Density | 1.8 | g/cm³ | ASTM D792 |
| Hardness | 55 | Shore A | ASTM D2240 |
| Application temperature | -60~180 | °C | - |
| Dielectric breakdown | 7 / 8 | KV | ASTM D149 |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 0.8 | W/m·K | ASTM D5470 |
| Thermal impedance@10 psi | 1.110 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@50 psi | 0.897 | °C-in²/ W | ASTM D5470 |
Related Products
SP-23
0.8 W/m·K
TO220 / TO3P
HC-93
2.5 W/m·K
TO220 / TO3P