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HC-93
2.5 W/m·K
TO220 / TO3P
Thermal Silicone Cap is a sleeve-type product made with silicone as the base material, combining both thermal conductivity and insulation properties. It is commonly used for heat dissipation in the packaging of various semiconductor components (such as transistors, diodes, and triodes). Widely used for hot transistors with reference to TO220 / TO3P packages.
CATEGORY
FEATURES
/ Thermal conductivity: 2.5 W/m·K
/ Excellent insulator
/ High recovery
/ Easy to assemble
/ Available in a range of thicknesses
CONFIGURATIONS
/ 11.4mm x 16.0mm x 5.8mm
/ 11.4mm x 21.5mm x 5.8mm
/ 17.5mm x 28.5mm x 5.8mm
TYPICAL APPLICATION
/ Between CPU and heat sink
/ Between a component and heat sink
/ Notebook computers
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | HC-93 | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Gray | - | Visual |
| Resin Base | Silicone | - | - |
| Thickness | 0.30 | 0.45 | mm | ASTM D374 |
| Density | 2.3 | g/cm³ | ASTM D792 |
| Hardness | 65 | Shore A | ASTM D2240 |
| Application temperature | -60~180 | °C | - |
| Dielectric breakdown | 7 | 8 | KV | ASTM D149 |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 2.5 | W/m·K | ASTM D5470 |
| Thermal impedance@10 psi | 0.830 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@50 psi | 0.462 | °C-in²/ W | ASTM D5470 |
Related Products
SP-23
0.8 W/m·K
TO220 / TO3P
HC-93
2.5 W/m·K
TO220 / TO3P