SP-23
0.8 W/m*K
TO220 / TO3P
液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
矽型 · 導熱材料 ——
HC-93
2.5 W/m*K
TO220 / TO3P
矽膠散熱帽套（Thermal Silicone Cap）是一種以矽膠為基材，兼具導熱與絕緣特性的套管式產品，常用於各類半導體元件（如電晶體、二極體、三極管）的封裝散熱。
Rubber Cap HC-93 是立體導熱絕緣矽橡膠帽，通過特殊的生產過程。由於其優良的導熱性、絕緣性、防震，組裝方便，廣泛用於熱晶體管參考 TO220 / TO3P。CATEGORY
FEATURES
/ Thermal conductivity: 2.5 W/m*K
/ Good insulator
/ High recovery
/ Easy to assemble
/ Available in a range of thicknesses
SPECIFICATIONS (LxWxH)
/ 11.4mm x 16.0mm x 5.8mm
/ 11.4mm x 21.5mm x 5.8mm
/ 17.5mm x 28.5mm x 5.8mm
TYPICAL APPLICATION
/ Between CPU and heat sink
/ Between a component and heat sink
/ Notebook computers
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | HC-93 | TEST METHOD | UNIT |
|---|---|---|---|
| Color | Gray | Visual | - |
| Resin base | Silicone | - | - |
| Thickness | 0.30 | 0.45 | ASTM D374 | mm |
| Density | 2.3 | ASTM D792 | g/cm³ |
| Hardness | 65 | ASTM D2240 | Shore A |
| Application temperature | -60~180 | - | °C |
| Dielectric breakdown | 7 | 8 | ASTM D149 | KV |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 2.5 | ASTM D5470 | W/m*K |
| Thermal impedance@10 psi | 0.830 | ASTM D5470 | °C-in²/ W |
| Thermal impedance@50 psi | 0.462 | ASTM D5470 | °C-in²/ W |
Related Product
HC-93
2.5 W/m*K
TO220 / TO3P