TEM96E
6.0 W/m*K
Absorber
Liquid
Solid
Absorber
Tape
Light
Insulator
Graphite
Break
TEM96C
4.0 W/m*K
Absorber
RF Absorbing Thermal Pad in medical devices, automotive electronic products, and military/aerospace sectors is of paramount importance. In these fields, electronic equipment failure due to electromagnetic interference or overheating could lead to severe, life-threatening, or mission-critical consequences.
CATEGORY
FEATURES
/ Thermal conductivity: 4.0 W/m*K
/ Excellent absorption characteristics
/ Naturally tacky
/ Reworkable
SPECIFICATIONS
/ Sheet form
/ Die-cut parts
TYPICAL APPLICATION
/ IC, CPU, MOS, LED, M/B, Heat sink
/ LCD-TV, Notebook PC, PC, Telecom device, Wireless hub
/ DDR II module, DVD applications, Hand-set applications
/ 5G base station & infrastructure
/ EV electric vehicle
// 2.4 GHz Wi-Fi Router , Bluetooth
// 3.5 GHz 5G Mobile Networks
// 5.0 GHz Wi-Fi Router
// 12~18 GHz Low Earth Orbit (LEO) System
// 28 GHz 5G Mobile Networks
// 39 GHz 5G Mobile Networks
TYPICAL PROPERTIES
| PROPERTY | TEM96C | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Dark Gray | - | Visual |
| Surface tack 2-side/1-side | 2 | - | - |
| Thickness | Customized | mm | ASTM D374 |
| Density | 3.6 | g/cm³ | ASTM D792 |
| Hardness | 55 | Shore OO | ASTM D2240 |
| TML | 0.04 | % | By LiPOLY |
| Water absorption | 0.04 | % | ASTM D570 |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 4.0 | W/m*K | ASTM D5470 |
| Thermal impedance@10 psi | 0.462 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@50 psi | 0.353 | °C-in²/ W | ASTM D5470 |
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TEM96B
3.0 W/m*K
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TEM96A
2.0 W/m*K
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