Liquid
Solid
Absorber
Tape
Light
Insulator
Graphite
Break
TEM96B
3.0 W/m·K
Absorber
EMI Shielding Thermal Pad in 5G systems, IoT systems, and wireless charging applications not only improve existing technologies but are directly related to regulatory compliance, risk mitigation, and ultimately operational safety and accuracy. Electronic devices, due to higher frequencies and more intensive network demands, inherently generate more complex electromagnetic interference and thermal loads.
CATEGORY
FEATURES
/ Thermal conductivity: 3.0 W/m·K
/ Excellent absorption characteristics
/ Naturally tacky for ease of manufacture
/ Reworkable
CONFIGURATIONS
/ Sheets form
/ Die-cuts parts
TYPICAL APPLICATION
/ IC, CPU, MOS, LED, M/B, Heat sink
/ LCD-TV, Notebook PC, PC, Telecom device, Wireless hub
/ DDR II module, DVD applications, Hand-set applications
/ 5G base station & infrastructure
/ EV electric vehicle
// 2.4 GHz Wi-Fi Router , Bluetooth
// 3.5 GHz 5G Mobile Networks
// 5.0 GHz Wi-Fi Router
// 12~18 GHz Low Earth Orbit (LEO) System
// 28 GHz 5G Mobile Networks
// 39 GHz 5G Mobile Networks
Attenuation
TYPICAL PROPERTIES
| PROPERTY | TEM96B | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Dark Gray | - | Visual |
| Surface tack 2-side/1-side | 2 | - | - |
| Thickness | Customized | mm | ASTM D374 |
| Density | 3.9 | g/cm³ | ASTM D792 |
| Hardness | 45 | Shore OO | ASTM D2240 |
| TML | 0.07 | % | By LiPOLY |
| Water absorption | 0.04 | % | ASTM D570 |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 3.0 | W/m·K | ASTM D5470 |
| Thermal impedance@10 psi | 0.634 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@50 psi | 0.516 | °C-in²/ W | ASTM D5470 |
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