RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
TEM96B
3.0 W/m*K
Absorber
EMI Shielding Thermal Pad in 5G systems, IoT systems, and wireless charging applications not only improve existing technologies but are directly related to regulatory compliance, risk mitigation, and ultimately operational safety and accuracy. Electronic devices, due to higher frequencies and more intensive network demands, inherently generate more complex electromagnetic interference and thermal loads. Therefore, high-performance EMI thermal conductive absorbing pads have become a key solution for ensuring stable device operation and enhancing product competitiveness.

CATEGORY

FEATURES

/ Thermal conductivity: 3.0 W/m*K
/ Excellent absorption characteristics
/ Naturally tacky
/ Reworkable

SPECIFICATIONS

/ Sheet form
/ Die-cut parts

TYPICAL APPLICATION

/ IC, CPU, MOS, LED, M/B, Heat sink
/ LCD-TV, Notebook PC, PC, Telecom device, Wireless hub
/ DDR II module, DVD applications, Hand-set applications
/ 5G base station & infrastructure
/ EV electric vehicle

// 2.4 GHz Wi-Fi Router , Bluetooth
// 3.5 GHz 5G Mobile Networks
// 5.0 GHz Wi-Fi Router
// 12~18 GHz Low Earth Orbit (LEO) System
// 28 GHz 5G Mobile Networks
39 GHz 5G Mobile Networks

TYPICAL PROPERTIES

PROPERTY TEM96B UNIT TEST METHOD
Color Dark Gray - Visual
Surface tack 2-side/1-side 2 - -
Thickness Customized mm ASTM D374
Density 3.9 g/cm³ ASTM D792
Hardness 45 Shore OO ASTM D2240
TML 0.07 % By LiPOLY
Water absorption 0.04 % ASTM D570
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 3.0 W/m*K ASTM D5470
Thermal impedance@10 psi 0.634 °C-in²/ W ASTM D5470
Thermal impedance@50 psi 0.516 °C-in²/ W ASTM D5470

Related​ Product

TEM96B
3.0 W/m*K
Absorber

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    熱介面管理專家

    LiPOLY® Advance TIMs

    桃園市八德區永豐路435號

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