Liquid
Solid
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Tape
Light
Insulator
Graphite
Break
New, Silicone・TIMs ——
Ti900-s
1.5 W/m·K
Ultra-thin Absorber
Thin Thermally Conductive EMI Absorber Pad is an advanced composite material that ingeniously combines both thermal conductivity and electromagnetic wave absorption functions. It is designed to address the increasingly severe heat dissipation issues and electromagnetic interference (EMI) challenges in modern electronic devices, especially in applications where space is limited and high requirements for cooling performance and EMI resistance exist.
CATEGORY
FEATURES
/ Thermal conductivity: 1.5 W/m·K
/ Excellent absorption characteristics
/ Naturally tacky for ease of manufacture
/ Reworkable
CONFIGURATIONS
/ Sheets form
/ Die-cuts parts
TYPICAL APPLICATION
/ IC, CPU, MOS, LED, M/B, Heat sink
/ LCD-TV, Notebook PC, PC, Telecom device, Wireless hub
/ DDR II module, DVD applications, Hand-set applications
/ 5G base station & infrastructure
// 2.4 GHz Wi-Fi Router , Bluetooth
// 3.5 GHz 5G Mobile Networks
// 5.0 GHz Wi-Fi Router
// 12~18 GHz Low Earth Orbit (LEO) System
// 28 GHz 5G Mobile Networks
// 39 GHz 5G Mobile Networks
Attenuation
TYPICAL PROPERTIES
| PROPERTY | Ti900-s | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Dark Gray | - | Visual |
| Surface tack 2-side/1-side | 2 | - | - |
| Thickness | 0.2 | mm | ASTM D374 |
| Density | 3.1 | g/cm³ | ASTM D792 |
| Hardness | 25 | Shore A | ASTM D2240 |
| TML | 0.04 | % | By LiPOLY |
| Water absorption | 0.04 | % | ASTM D570 |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 1.5 | W/m·K | ASTM D5470 |
| Thermal impedance@10 psi | 0.324 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@50 psi | 0.288 | °C-in²/ W | ASTM D5470 |
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Ti900-s
1.5 W/m·K
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