RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

Ultra Soft Gel Pad

Ultra-soft thermal conductive gel pads feature soft characteristics that prevent installation stress from causing deformation to PCBs and other components, making them the optimal choice for irregular surface gap filling. They are widely used in electronic devices such as power modules, LED lighting fixtures, and battery management systems.

BS89-s
5.0 W/m·K
Shore OO/25
Exceptionally Soft Thermal Pad is a pre-formed, flexible thermal interface pad made from gel material. It combines the moldability of gel with the high thermal conductivity of silicone pads, enhancing compatibility during device assembly. This pad effectively fills irregular or large gaps, as well as products with complex structures such as protrusions or recesses. It is easy to handle, helping to reduce assembly costs and workload, and is widely used in fields such as communication equipment, computer motherboards, and memory modules.
BS75K-s
3.0 W/m·K
Shore OO/18
BS87-s
3.0 W/m·K
Shore OO/10
Exceptionally Soft Thermal Pad is a pre-formed, flexible thermal interface pad made from gel material. It combines the moldability of gel with the high thermal conductivity of silicone pads, enhancing compatibility during device assembly. This pad effectively fills irregular or large gaps, as well as products with complex structures such as protrusions or recesses. It is easy to handle, helping to reduce assembly costs and workload, and is widely used in fields such as communication equipment, computer motherboards, and memory modules.
BS75K-s
3.0 W/m·K
Shore OO/18
BS87-s
3.0 W/m·K
Shore OO/10
BS89-s
5.0 W/m·K
Shore OO/25
BS89-s
5.0 W/m·K
Shore OO/25
Exceptionally Soft Thermal Pad is a pre-formed, flexible thermal interface pad made from gel material. It combines the moldability of gel with the high thermal conductivity of silicone pads, enhancing compatibility during device assembly. This pad effectively fills irregular or large gaps, as well as products with complex structures such as protrusions or recesses. It is easy to handle, helping to reduce assembly costs and workload, and is widely used in fields such as communication equipment, computer motherboards, and memory modules.
BS75K-s
3.0 W/m·K
Shore OO/18
BS87-s
3.0 W/m·K
Shore OO/10

Thermal Solutions Expert

LiPOLY® Advance TIMs

Taoyuan City, Bade District, Yongfeng Road, No. 435

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