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Why Do Immersion Cooling Systems Still Need Thermal Pads?

LiPOLY®

Why Do Immersion Cooling Systems Still Need Thermal Pads?

Immersion cooling technology submerges electronic devices completely in non-conductive coolant, which seems to provide direct heat dissipation. However, the thermal conductivity of coolant is far lower than that of metal heat sinks. Liquid convection alone cannot effectively handle the concentrated heat generated by electronic components. Thermal pads can fill microscopic gaps between components and heat dissipation structures, providing higher thermal conductivity pathways, overcoming boundary layer limitations, and replacing easily dissolved traditional thermal paste to ensure optimal heat dissipation efficiency in immersion systems

Although immersion cooling systems fully submerge components in coolant, coolant alone is insufficient for effective heat dissipation.

Low Thermal Conductivity of Coolant

The thermal conductivity of coolant is far lower than that of metals or high-thermal-conductivity solid materials. Therefore, to enable effective heat conduction to large-area heat dissipation structures, high-thermal-conductivity materials are still needed between components and heat dissipation structures to fill gaps and increase contact area, ensuring rapid heat conduction.

Protection of Sensitive Components

Some components may not be suitable for long-term direct contact with coolant. Thermal pads can not only improve thermal conduction but also serve as isolation layers, providing additional protection for sensitive components and enhancing system safety.

Boundary Layer and Convection Limitations

In single-phase immersion systems, heat transfer mainly relies on forced convection. However, coolant flow velocity on component surfaces may be limited due to shielding, forming boundary layers that affect heat dissipation efficiency. By directing heat through thermal pads to heat sink surfaces with better flow, hotspot temperatures can be effectively reduced.

Replacement of Traditional Thermal Paste

Traditional thermal paste easily dissolves or is lost in immersion environments, while Engineered Fluids certified DTT61-s thermal pads can withstand coolant for long periods without contaminating the liquid, maintaining stable high thermal conductivity.

Immersion cooling technology submerges electronic devices completely in non-conductive coolant, which seems to provide direct heat dissipation. However, the thermal conductivity of coolant is far lower than that of metal heat sinks. Liquid convection alone cannot effectively handle the concentrated heat generated by electronic components. Thermal pads can fill microscopic gaps between components and heat dissipation structures, providing higher thermal conductivity pathways, overcoming boundary layer limitations, and replacing easily dissolved traditional thermal paste to ensure optimal heat dissipation efficiency in immersion systems
Immersion cooling technology submerges electronic devices completely in non-conductive coolant, which seems to provide direct heat dissipation. However, the thermal conductivity of coolant is far lower than that of metal heat sinks. Liquid convection alone cannot effectively handle the concentrated heat generated by electronic components. Thermal pads can fill microscopic gaps between components and heat dissipation structures, providing higher thermal conductivity pathways, overcoming boundary layer limitations, and replacing easily dissolved traditional thermal paste to ensure optimal heat dissipation efficiency in immersion systems
Immersion cooling technology submerges electronic devices completely in non-conductive coolant, which seems to provide direct heat dissipation. However, the thermal conductivity of coolant is far lower than that of metal heat sinks. Liquid convection alone cannot effectively handle the concentrated heat generated by electronic components. Thermal pads can fill microscopic gaps between components and heat dissipation structures, providing higher thermal conductivity pathways, overcoming boundary layer limitations, and replacing easily dissolved traditional thermal paste to ensure optimal heat dissipation efficiency in immersion systems
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LiPOLY® Advance TIMs

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