Liquid series
High-Flow gap fillers fully cover irregular surfaces, unlike thermal pads.
Solid series
Including high ductile, ultra-thin, ultra-soft, and low-bleed Thermal pads.
EMI Shielding Pad
Thermal conductive & RF absorption, enhancing product reliability.
Tape series
Reduces heatsink bonding steps while solving fixation and thermal issues.
Lightweight series
Reduce device weight while offering high thermal conductivity.
Electrical insulator
Ideal for applications needing both thermal and electrical solutions.
Graphite Sheets
Ultra-thin, flexible, perfect for space-saving & high-performance devices.
Thermal Break
Lightweight composite withstands 1300°C to prevent thermal runaway.
New products
Newest
Shiu Li Technology is committed to yearly launches of new innovations, delivering excitement. More than grand events, these launches showcase our strength. With our team's breakthroughs, your products will set trends—this is Shiu Li Technology's power!
Technologies
Development
In line with technological development trends and the global environmental protection movement, we continuously deliver outstanding R&D outputs in product and process development.
Material Analysis
Control of hazardous substances in accordance with customer and environmental requirements.
Reliability Laboratory
Effectively control and prevent all potential quality issues that may occur.
Manufacture
Cleanrooms, automated equipment, and diverse molding technologies.
Patents
Holds multiple global patents for thermal conductive materials.
Company
About Us
LiPOLY® TIMs Technology possesses profound technical expertise and extensive application experience, with top-tier talent from diverse fields dedicated to developing high-performance thermal management and innovative materials. Equipped with state-of-the-art laboratory facilities and automated manufacturing equipment, we conduct high-precision testing and analysis to ensure product stability and reliability.
Professional Quality
We maintain a comprehensive quality management system and have obtained international certifications.
Company History
In June 2002, we developed and manufactured the first batch of K0.8 to K3 thermally conductive materials.
Responsible Business Alliance
RBA Code of Conduct
旭立科技開發高導熱的非矽行的材料，能有效將熱源傳遞到散熱模組，且不產生低分矽氧烷，並確保PCB電性正確，鏡頭影像不受影響。
Thermal Solutions Expert
LiPOLY® Advance TIMs
Taoyuan City, Bade District, Yongfeng Road, No. 435
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