Product Series Introduction

With the rise of the Internet of Things (IoT) concept, the trend in electronic products has shifted from pursuing slimmer and lighter designs to developing higher power, higher speed, and higher density. In the overall high-power module, to simultaneously consider thinness, high density, and high power, the design of chips and components must possess high functionality, high transmission, and high efficiency. However, the resulting waste heat and rapidly increasing hotspot temperatures are problems that urgently need to be addressed.

In high-power module applications, Thermal Interface Materials (Thermal Interface Material) aim not only for a high thermal conductivity but also for reducing interface thermal resistance and improving material reliability, which will be an important issue for future applications. There are extremely fine uneven gaps between the surface of electronic materials and the heat sink, causing significant contact thermal resistance between electronic components and the heat sink, severely hindering thermal conduction. Using TIMs with high thermal conductivity and flexibility can fully fill these gaps, eliminate the air within, significantly reduce thermal resistance, and establish the most effective thermal transfer.

LiPOLY Technology, from research and design, production manufacturing, to quality inspection and testing, is entirely self-manufactured by LiPOLY itself, allowing for the immediate provision of cutting-edge heating solutions to meet clients' special needs for today's advanced products and customized services.