液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
非矽型 · 導熱材料 ——
NEP230
3.0 W/m·K
Low outgassing
NEP230是一種結合導熱與接著功能的非矽型導熱固定膠，可以在室溫或高溫下固化後具有良好的固定力，與導熱墊片相比，導熱膠不僅對部件產生低應力，同時能保持絕緣性能。無低分子矽氧烷揮發，不會造成電器接點故障，適合光學產品或敏感的電子原件使用。可以搭配LiPOLY之putty專用智能機，是自動化點膠作業生產的理想選擇。
CATEGORY
Thermal Putty
FEATURES
/ Thermal conductivity: 3.0 W/m*K
/ Can be applied with dispenser
/ Room Temperature curing or heating curing
/ Low compression stress during assembly
/ Excellent adhesion to metal & PCB
CONFIGURATIONS
/ Cartridges:50ml, 400ml
/ Other special and custom sizes are available upon request
TYPICAL APPLICATION
/ Electronic components: IC、CPU MOS、Mother Board、Wireless Hub Telecom Device 、Automotive electronics、Computer 、 Peripherals and High frequency magnetic inductor
/ Between any heat-generating component and a heat sink.
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | NEP230 | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Gray-A Black-B | - | Visual |
| Resin base | Epoxy | - | - |
| A:B | 100:100 | - | - |
| Viscosity A | 270 | Pa.s | ISO 3219 |
| Viscosity B | 240 | Pa.s | ISO 3219 |
| Hardness | 90 | Shore A | ASTM D2240 |
| Tensile strength | 60 | N/cm² | ISO527 |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 3.0 | W/m*K | ISO 22007-2 |
| Dielectric breakdown | 14 | KV/mm | ASTM D149 |
| Volume resistivity | >10¹¹ | Ohm-m | ASTM D257 |
Related Product
NEP220
2.2 W/m·K
Low outgassing