液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
非矽型 · 導熱材料 ——
EP770-s
2.5 W/m*K
Low outgassing
PCB 導熱灌膠 EP770-s是非矽型灌膠，無低分子矽氧烷揮發，不會造成電器接點故障，適合光學產品或敏感的電子原件使用。透過將液態膠體澆灌並固化於電子組件之間，可填滿電子器件周圍空氣空間的縫隙，形成長期且有效的防護層，可達到防水、防潮、耐震、電氣絕緣和保護關鍵線束等多重效果。
CATEGORY
Sealing Glue
FEATURES
/ Thermal conductivity: 2.5 W/m*K
/ Thermally conductive vibration dampening
/ Low mixing viscosity
/ Extremely low Shrinkage rate 0.01%.
/ Epoxy Based material with high hardness for support
/ Slow sedimentation rate due to Resin & powder mixing perfectly via superb processing technology. It leads EP770-s material easy to mix and disperse
CONFIGURATIONS
/ Tinplate Can:1 kg
/ Other special and custom sizes are available upon request
TYPICAL APPLICATION
/ Motor: Torque motor、Linear Motor Servo motor
/ IGBT module
/ Electronic components: IC、CPU、MOS、Mother Board
/ Wireless Hub
/ Automotive electronics
/ Between any heat-generating component and a heat sink
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | EP770-s | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Black | - | Visual |
| Resin base | Epoxy | - | - |
| A:B | 100:10 | - | - |
| Viscosity A | 350 | Pa.s | ISO 3219 |
| Viscosity mixed | 5 | Pa.s | ISO 3219 |
| Hardness (AFTER CURE) | 80 | Sore A | ASTM D2240 |
| Tensile strength | 73 | N/cm² | ISO527 |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 2.5 | W/m*K | ASTM D5470 |
| Dielectric breakdown | 14 | KV/mm | ASTM D149 |
| Volume resistivity | >10¹¹ | Ohm-m | ASTM D257 |
Related Product
EP770-s
2.5 W/m*K
Low outgassing