RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
NL-putty04-s
4.0 W/m*K
Low outgassing
LiPOLY之NL-putty系列是一種非矽型低密度的凝膠填縫材料。低密度、輕量化特性,可為產品提高其性能、降低生產成本及減少材料的使用和能源消耗等,常被應用在電子產品及汽車電子設備上。產品導熱係數4.0 -10.0 W/m*K,非矽型特性無低分子矽氧烷揮發,不會造成電器接點故障。具有高變形量,可靈活性的適配間隙,兼具公差補償特性.可克服溢流乾凅問題, 提高熱傳導,適合自動化點膠生產。

CATEGORY

FEATURES

/ Lightweight, Low Density, Thermal Conductivity: 4.0 W/m*K
/ High flow rate, extrusion rate under 90psi&60s conditions: 29g/min
/ Bond line thickness:100~1500µm
/ Non-silicone resin materials
/ Designed to remove manufacturing tolerances
/ Does not produce stress on delicate components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression and low stress application

VERTICAL RELIABILITY

sing 1.5mm pad as a gap control, put the putty between the
aluminum and the glass panel mark the initial position. Then,
place it in the oven with 125℃ for 1,000 hours and observe its
displacement after reliability test

TYPICAL APPLICATION

/ lightweight applications, such as Automotive electronic devices, Mobile communication device, Drone & aircraft,Sports and leisure electronic products, Portable computers and tablets,wearable devices, Portable game consoles, VR devices and etc.

TYPICAL PROPERTIES

PROPERTY NL-putty04-s UNIT TEST METHOD
Color Yellow - Visual
Resin base Non-Silicone - -
Viscosity 2500 Pa.s DIN 53018
Flow Rate 29 g/min By LiPOLY
Density 2.3 g/cm³ ASTM D792
Application temperature -60~125 °C -
Bond line thickness 100~1500 μm -
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 4.0 W/m*K ASTM D5470
Thermal impedance@10psi / 80°C 0.088 °C-in²/ W ASTM D5470
Thermal impedance@30psi / 80°C 0.081 °C-in²/ W ASTM D5470

Related​ Product

NL-putty04-s
4.0 W/m*K
Low outgassing

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