液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
矽型 · 導熱材料 ——
AS02-s
4.5 W/m*K
Thickness 0.15 / 2.0 mm
AS02-s是一種具有雙面粘性、低熱阻和高導熱性的材料。它具有優異的抗壓強度特性和良好的電氣隔離功能，適用於高功率電子元件，使其成為薄型設計安裝的最佳選擇。可提供定制的模切和成型服務。
CATEGORY
FEATURES
/ Great thermal conductivity
/ Low thermal impedance
/ High compressibility
/ Excellent elasticity
/ Suitable for high performance products
/ Die-cut part
SPECIFICATIONS
/ Roll form
/ Sheet form
/ Die-cut parts
TYPICAL APPLICATION
/ Electronic Components – Notebookcomputers, Heat pipe assemblies, Memory modules, TV hardware, Automotive electronics, Mobile devices, HPC , servers 5G base station & infrastructure, EV electric vehicle
Thermal Resistance vs. Pressure vs. Deflection
TYPICAL PROPERTIES
| PROPERTY | AS02-s | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Green | - | Visual |
| Thickness | 0.15 | 0.20 mm | mm | ASTM D374 |
| Thickness | 0.0059 | 0.0079 in | inch | ASTM D374 |
| Volume resistivity | 1x10¹² | Ohm -m | ASTM D257 |
| Elongation | 10 | % | ASTM D412 |
| Weight loss | <1 | % | By LiPOLY |
| Application temperature | -50~180 | °C | - |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 4.5 | 4.5 | W/m*K | ASTM D5470 |
| Thermal impedance@10 psi | 0.181 | 0.266 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@50 psi | 0.128 | 0.151 | °C-in²/ W | ASTM D5470 |
Related Product
AS02-s
4.5 W/m*K
Thickness 0.15 / 2.0 mm