液態
墊片
吸波
膠帶
絕緣
石墨
輕量
斷熱
/ Thermal conductivity: 20.0 W/m*K
/ High compression rate
/ Extremely low thermal impedance
/ Between CPU and heat sink
/ Between a component and heat sink
/ Flat-panel displays
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ 5G base station & infrastructure
/ High-end Chip
PROPERTY | T-work9000 | TEST METHOD | UNIT |
---|---|---|---|
Color | Brown | Visual | - |
Surface tack 2-side/1-side | 2 | - | - |
Thickness | Customized | ASTM D374 | mm |
Density | 3.3 | ASTM D792 | g/cm³ |
Hardness | 65 | ASTM D2240 | Shore OOO |
TML | <0.1 | By LiPOLY | % |
Application temperature | -60~150 | - | °C |
ROHS & REACH | Compliant | - | - |
THERMAL | |||
Thermal conductivity | 20.0 | ASTM D5470 | W/m*K |
Thermal Conductivity | 12.0 | ISO 22007-2 | W/m*K |
Thermal impedance@10psi | 0.110 | ASTM D5470 | °C-in²/ W |