液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
矽型 · 導熱材料 ——
BS75K-s
3.0 W/m·K
Shore OO/18
BS75K-s 是具有極高柔軟度的超軟導熱矽膠片，可避免PCB等零部件在安裝時因擠壓而造成變形，可充分填補機構設計的正負公差。BS75K-s 熱傳導係數 3.0 W/m*K，硬度Shore OO/18，具有高柔軟性、高壓縮性、高絕緣、自黏性佳，可客製化裁切沖型，滿足客戶在面對今日先進產品上特殊的需求。
CATEGORY
FEATURES
/ Thermal conductivity: 3.0 W/m*K
/ High compression rate
/ Low thermal impedance
/ High recovery
/ Available in a range of thicknesses
SPECIFICATIONS
/ Roll form
/ Sheet form
/ Die-cut parts
TYPICAL APPLICATION
/ Between CPU and heat sink
/ Between a component and heat sink
/ Notebook computers
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ 5G base station & infrastructure
/ EV electric vehicle
Thermal Resistance vs. Pressure vs. Deflection
TYPICAL PROPERTIES
| PROPERTY | BS75K-s | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Dark Gray | - | Visual |
| Surface tack 2-side/1-side | Customized | - | - |
| Thickness | Customized | mm | ASTM D374 |
| Density | 2.6 | g/cm³ | ASTM D792 |
| Hardness | 18 | Shore OO | ASTM D2240 |
| Application temperature | -60~180 | °C | - |
| Dielectric breakdown | 12 | KV/mm | ASTM D149 |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 3.0 | W/m*K | ASTM D5470 |
| Thermal impedance@10 psi | 0.562 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@50 psi | 0.463 | °C-in²/ W | ASTM D5470 |
Related Product
S282-s
2.5 W/m·K
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BS89-s
5.0 W/m·K
Shore OO/25
BS87-s
3.0 W/m·K
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