RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

非矽型 · 導熱材料

非矽型導熱材料多使用碳氫化合物或其他聚合物作為基底,應用在光學、醫療、半導體等敏感領域,尤其是在需要嚴格防止矽揮發或污染時,往往成為最佳選擇。

G3380NT
6.0 W/m*K
Low outgassing
G566A
1700 W/m*K
Thickness 35 µm
G566AP
1700 W/m*K
Thickness 45 µm
N-putty-s
3.5 W/m*K
N-putty2-s
5.0 W/m*K
N-putty3-s
7.0 W/m*K
N-putty5-s
9.0 W/m*K
N700A-s
2.5 W/m*K
Low Outgassing
N700B-s
3.0 W/m*K
Low Outgassing
N700C-s
5.0 W/m*K
Low Outgassing
N800A-s
9.0 W/m*K
Low Outgassing
N800AH-s
7.0 W/m*K
Low Outgassing
N800AH-s
7.0 W/m*K
Low Outgassing
G3380NT
6.0 W/m*K
Low outgassing
NL-putty06-s
6 W/m*K
N-putty2-s
5.0 W/m*K
N700C-s
5.0 W/m*K
Low Outgassing
G3380NK
4.5 W/m*K
Low outgassing
NT94-s
4 W/m*K
NL-putty04-s
4 W/m*K
N-putty-s
3.5 W/m*K
AT920-s
3.5 W/m*K
G3380NJ
3.2 W/m*K
Low outgassing
N700B-s
3.0 W/m*K
Low Outgassing

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