RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

導熱填縫膠

矽型導熱液態膠與導熱墊片相比,導熱膠不僅對部件產生低應力、高導熱性、低粘度,同時能保持絕緣性能,熱傳導係數:2.2-7.0W/m*K的間隙填充材料,可以搭配LiPOLY之putty專用智能機,自動化點膠作業生產的理想選擇。

導熱填隙劑

PK700DM
7.0 W/m*K
Fast Curing in room temperature
PK605DM
5.0 W/m*K
Fast Curing in room temperature
PK404DM
3.6 W/m*K
Fast Curing in room temperature
PK223DM
2.2 W/m*K
Fast Curing in room temperature
PK223DM
2.2 W/m*K
Fast Curing in room temperature
PK404DM
3.6 W/m*K
Fast Curing in room temperature
PK605DM
5.0 W/m*K
Fast Curing in room temperature
PK700DM
7.0 W/m*K
Fast Curing in room temperature
PK700DM
7.0 W/m*K
Fast Curing in room temperature
PK605DM
5.0 W/m*K
Fast Curing in room temperature
PK404DM
3.6 W/m*K
Fast Curing in room temperature
PK223DM
2.2 W/m*K
Fast Curing in room temperature

For all informaton you need

CALL US: 03-3788588

熱介面管理專家

旭立科技股份有限公司

桃園市八德區永豐路435號

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