NEW Product
/ Thermal conductivity: 2.5 W/m·K
/ Designed for manufacturing
/ High dielectric breakdown
/ Shock and vibration absorber
/ Good mechanical strength
/ Fiberglass reinforced
/ Roll form
/ Sheets form
/ Die-cuts parts
/ Between a component and heat sink
/ Flat-panel displays
/ LED, HDDs, DVDs
/ Heat pipe assemblies
/ Memory modules
/ Power supplies
/ 5G base station & infrastructure
/ EV electric vehicle
| PROPERTY | Ultra Soft Thermal Pad | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Pink | - | Visual |
| Surface tack 2-side/1-side | 1 | - | - |
| Reinforced layer | Fiberglass | - | - |
| Thickness | Customized | mm | ASTM D374 |
| Density | 2.6 | g/cm³ | ASTM D792 |
| Hardness | 18 | Shore OO | ASTM D2240 |
| Application temperature | -60~180 | °C | - |
| ROHS & REACH | Compliant | ||
| THERMAL | |||
| Thermal conductivity | 2.5 | W/m*K | ASTM D5470 |
| Thermal impedance@10 psi | 1.094 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@50 psi | 0.941 | °C-in²/ W | ASTM D5470 |
