Thermal 5G Absorber Pad NT92-s is made of non-silicone resin materials with no low molecular siloxane volatilization, featuring a composite pad that combines thermal conductivity and electromagnetic wave absorption functions. This gap filler material has a thermal conductivity of 2.0 W/m*K, operates in the frequency range of 10MHz-77GHz, and offers flexibility and compressibility with customizable die-cutting and stamping capabilities. SunRise's professional R&D expertise enables us to immediately provide cutting-edge thermal management solutions to meet customers' specialized requirements for today's advanced products.