Curing Grease

This product is a high thermal conductivity liquid material designed for AI chip cooling, offering excellent gap-filling capability and heat-curable properties to effectively reduce junction temperatures in high-performance computing systems. Its stable material structure makes it an ideal thermal interface material for immersion cooling, maintaining consistent thermal performance under prolonged liquid exposure and thermal cycling conditions.

In addition, this heat-curable liquid TIM for EV applications is engineered to withstand long-term thermal cycling, making it suitable for electric vehicles and other high-load operating environments. It delivers a reliable thermal management solution for advanced electronics and automotive applications requiring long-term stability and high reliability.