Advanced Materials

Designed for immersion cooling of high-power AI chips and thermal management of high-power modules and chips in electric vehicles, this material delivers long-term stable and efficient thermal performance. It is fully compatible with cooling fluids and withstands prolonged immersion without dissolution, swelling, or contaminant leaching. Even under high load and harsh operating conditions, it maintains reliable heat transfer performance, providing a high-reliability thermal management solution for next-generation systems.