液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
非矽型 · 導熱材料 ——
N800A-s
9.0 W/m·K
Low Outgassing
無矽質導熱墊片已成為現代電子設備熱管理領域不可或缺的解決方案。它們透過消除低分子矽氧烷揮發帶來的污染風險，提供卓越的電氣絕緣性能，並展現出與傳統矽基材料相媲美甚至超越的熱傳導能力，從而顯著提升了設備的可靠性與長期穩定性。
CATEGORY
FEATURES
/ Thermal conductivity: 9.0 W/m*K
/ It’s made by non-silicone resin materials
/ Low contact thermal resistance
/ With electrical insulation
/ Outstanding thermal conductivity
/ Applicable to optical and sensitive electric components
SPECIFICATIONS
/ Sheet form
/ Die-cut parts
TYPICAL APPLICATION
/ HDDS
/ Optical appliance
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | N800A-s | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Pink | - | Visual |
| Surface tack 2-side/1-side | 2 | - | - |
| Thickness | Customized | mm | ASTM D374 |
| Density | 3.4 | g/cm³ | ASTM D792 |
| Hardness | 50 | Shore OO | ASTM D2240 |
| Tensile Strength | 0.15 | Kgf/cm² | ASTM D412 |
| Outgassing CVCM (wt%) | 0.0049 | - | By LiPOLY |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 9.0 | W/m*K | ASTM D5470 |
| Thermal impedance@10 psi | 0.238 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@30 psi | 0.102 | °C-in²/ W | ASTM D5470 |
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