液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
非矽型 · 導熱材料 ——
N800CH-s
15.0 W/m·K
Low Outgassing
不含矽氧烷導熱墊片最引人注目且獨特的優勢在於其能夠從根本上防止低分子矽氧烷（LMS）的揮發。LMS，其化學式為Ho-n-H，是一種常見於許多傳統矽基材料中的揮發性環狀聚二甲基矽氧烷 。在長期受熱和壓力環境下，LMS會揮發並隨後遷移，導致不必要的污染，尤其是在密閉的電子環境中 。這種污染會引發嚴重的問題，例如電氣接觸失效、「霧化」或敏感光學鏡頭的模糊 ，以及周圍電子元件的普遍劣化 。
CATEGORY
FEATURES
/ Thermal conductivity:15.0 W/m*K
/ It’s made by non-silicone resin materials
/ Low contact thermal resistance
/ With electrical insulation
/ Outstanding thermal conductivity
/ Applicable to optical and sensitive electric components
SPECIFICATIONS
/ Sheet form
/ Die-cut parts
TYPICAL APPLICATION
/ HDDS
/ Optical appliance
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | N800CH-s | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Gray | - | Visual |
| Surface tack 2-side/1-side | 2 | - | - |
| Thickness | Customized | mm | ASTM D374 |
| Density | 3.3 | g/cm³ | ASTM D792 |
| Hardness | 50 | Shore OO | ASTM D2240 |
| Tensile Strength | 0.15 | Kgf/cm² | ASTM D412 |
| Outgassing CVCM (wt%) | 0.0040 | - | By LiPOLY |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 15.0 | W/m*K | ASTM D5470 |
| Thermal impedance@10 psi | 0.153 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@30 psi | 0.067 | °C-in²/ W | ASTM D5470 |
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