液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
非矽型 · 導熱材料 ——
N800BH-s
11.0 W/m·K
Low Outgassing
不含矽導熱墊片材料在光學設備、醫療儀器、半導體製造、汽車電子、5G通訊以及高性能計算等敏感和關鍵應用中扮演著至關重要的角色。它們不僅解決了特定環境下的污染問題，更為高功率密度、小型化和高集成度的現代電子產品提供了穩定的運行基礎。
CATEGORY
FEATURES
/ Thermal conductivity:11.0 W/m*K
/ It’s made by non-silicone resin materials
/ Low contact thermal resistance
/ With electrical insulation
/ Outstanding thermal conductivity
/ Applicable to optical and sensitive electric components
SPECIFICATIONS
/ Sheet form
/ Die-cut parts
TYPICAL APPLICATION
/ HDDS
/ Optical appliance
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | N800BH-s | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Pink | - | Visual |
| Surface tack 2-side/1-side | 2 | - | - |
| Thickness | Customized | mm | ASTM D374 |
| Density | 3.3 | g/cm³ | ASTM D792 |
| Hardness | 50 | Shore OO | ASTM D2240 |
| Tensile Strength | 0.15 | Kgf/cm² | ASTM D412 |
| Outgassing CVCM (wt%) | 0.0047 | - | By LiPOLY |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 11.0 | W/m*K | ASTM D5470 |
| Thermal impedance@10 psi | 0.210 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@30 psi | 0.088 | °C-in²/ W | ASTM D5470 |
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