N800CH-s
15.0 W/m*K
Low Outgassing
液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
New, 非矽型 · 導熱材料 ——
N800C-s
17.0 W/m*K
Low Outgassing
非矽型導熱墊片不會造成電氣接觸及污染問題，因「無矽污染」的核心優勢使其在光學、醫療、半導體等特定敏感應用中已是「不可替代」的選擇 。隨著電子產業朝向更高集成度、更高功率、更精密的方向發展，對非矽型導熱墊片的需求將從「矽型材料的替代品」轉變為「特定高端應用領域的必需品」。
CATEGORY
FEATURES
/ Thermal conductivity:17.0 W/m*K
/ It’s made by non-silicone resin materials
/ Low contact thermal resistance
/ With electrical insulation
/ Outstanding thermal conductivity
/ Applicable to optical and sensitive electric components
SPECIFICATIONS
/ Sheet form
/ Die-cut parts
TYPICAL APPLICATION
/ HDDS
/ Optical appliance
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | N800C-s | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Gray | - | Visual |
| Thickness | Customized | mm | ASTM D374 |
| Density | 3.3 | g/cm³ | ASTM D792 |
| Hardness | 50 | Shore OO | ASTM D2240 |
| Application temperature | -60~125 | °C | - |
| Low molecular Siloxane (D3 to D20 total) | N.D | % | Gas Chromatography |
| Outgassing CVCM (wt%) | 0.0043 | - | By LiPOLY |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 8 | KV/mm | ASTM D149 |
| Thermal impedance@10 psi | 0.122 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@30 psi | 0.058 | °C-in²/ W | ASTM D5470 |
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