液体
シート
吸収
テープ
軽量
絶縁
黒鉛
断熱
シリコーン・熱伝導製品 ——
/ Lightweight, Low Density Thermal Conductivity: 4.0 W/m*K
/ High flow rate, extrusion rate under 90psi&60s conditions:56 g/min
/ Bond line thickness:100-1500µm
/ Designed to remove manufacturing tolerances
/ Does not produce stress on delicate components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression and low stress application
Using 1.5mm pad as a gap control, put the putty between the aluminum and the glass panel mark the initial position. Then, place it in the oven with 125℃ for 1,000 hours and observe its displacement after reliability test
/ lightweight applications, such as Automotive electronic devices, Mobile communication device, Drone & aircraft, Sports and leisure electronic products, Portable computers and tablets, wearable devices, Portable game consoles, VR devices and etc.
特性項目 | DTT04-s | 単位 | 測定基準 |
---|---|---|---|
外観色 | Yellow | - | Visual |
ベースポリマー | Silicone | - | - |
粘度 | 1000 | Pa.s | DIN 53018 |
体積流量 | 56 | g/min | By LiPOLY |
比重 | 2.3 | g/cm³ | ASTM D792 |
使用温度範囲 | -60~150 | °C | - |
BLT(塗布厚み) | 100~1500 | μm | - |
ROHS & REACH | 対応 | - | - |
伝熱特性 | |||
熱伝導率 | 4.0 | W/m*K | ASTM D5470 |
熱抵抗@10psi / 60°C | 0.084 | °C-in²/ W | ASTM D5470 |
Thermal impedance@30psi / 60°C | 0.078 | °C-in²/ W | ASTM D5470 |