液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
矽型 · 導熱材料 ——
TEM96B
3.0 W/m·K
Absorber
高頻EMI導熱吸波墊片在「5G 系統」 、「物聯網系統」 和「無線充電」 中的應用，不僅改進了現有技術，更直接關係到法規遵循、風險緩解，並最終關係到操作安全和準確性。電子設備因更高的頻率和更密集的網路需求，本質上會產生更複雜的電磁干擾和熱負荷物，因此，高效能的EMI導熱吸波墊片，成為確保裝置穩定運作與提升產品競爭力的關鍵解決方案。
CATEGORY
FEATURES
/ Thermal conductivity: 3.0 W/m*K
/ Excellent absorption characteristics
/ Naturally tacky
/ Reworkable
SPECIFICATIONS
/ Sheet form
/ Die-cut parts
TYPICAL APPLICATION
/ IC, CPU, MOS, LED, M/B, Heat sink
/ LCD-TV, Notebook PC, PC, Telecom device, Wireless hub
/ DDR II module, DVD applications, Hand-set applications
/ 5G base station & infrastructure
/ EV electric vehicle
// 2.4 GHz Wi-Fi Router , Bluetooth
// 3.5 GHz 5G Mobile Networks
// 5.0 GHz Wi-Fi Router
// 12~18 GHz Low Earth Orbit (LEO) System
// 28 GHz 5G Mobile Networks
39 GHz 5G Mobile Networks
TYPICAL PROPERTIES
| PROPERTY | TEM96B | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Dark Gray | - | Visual |
| Surface tack 2-side/1-side | 2 | - | - |
| Thickness | Customized | mm | ASTM D374 |
| Density | 3.9 | g/cm³ | ASTM D792 |
| Hardness | 45 | Shore OO | ASTM D2240 |
| TML | 0.07 | % | By LiPOLY |
| Water absorption | 0.04 | % | ASTM D570 |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 3.0 | W/m*K | ASTM D5470 |
| Thermal impedance@10 psi | 0.634 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@50 psi | 0.516 | °C-in²/ W | ASTM D5470 |
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