RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
TIM14
4.0 W/m*K
TIM14 是可以在高溫下固化的雙劑型導熱接著固晶膠不僅對部件產生低應力、低熱阻、良好的黏著力,同時能保持絕緣性能,熱傳導係數 4.0W/m*K 的TIM 1間隙導熱填充材料,適合自動化點膠作業生產 。

CATEGORY

Thermal Putty

FEATURES

/ Excellent thermal conductivity 4.0 W/m*K
/ No freeze preservation required
/ Dispensable for serial manufacture
/ Adhesive for IC packaging design

CONFIGURATIONS

/ Cartridges: 50ml

TYPICAL APPLICATION

/ Designed to provide efficient thermal transfer for the cooling of chip packaging as TIM-1.
/ 5G base station & infrastructure
/ EV electric vehicle

TYPICAL PROPERTIES

PROPERTY TIM14 TEST METHOD UNIT
Color Gray-A White-B Visual -
Resin base Silicone - -
Form Grease Visual -
Viscosity A/B 380 ISO 3219 Pa.s
Working time 25°C / 24hr By LiPOLY -
BLT 27 - µm
Elongation 110 ASTM D412 %
Adhesive strength 3.5 - kgf/cm²
THERMAL
Thermal conductivity 4.0 ASTM D5470 W/m*K
Dielectric breakdown 25 ASTM D149 KV/mm
Surface resistivity >10¹³ ASTM D257 Ohm

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