RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
D2000
2.0 W/m*K
D2000是可以在室溫或高溫下固化雙劑導熱膏,具有極低熱阻及高可靠度的導熱膏,不會有乾凅、溢流問題。

CATEGORY

Thermal Putty

FEATURES

/ Thermal conductivity:2.0 W/m*K
/ Cured and Re-workable thermal Grease.
/ Without Pump-out and Dry out concern.
/ Great reliability
/ Low thermal resistance and thinner Bond Line Thickness.

CONFIGURATIONS

/ Cartridges: 50ml, 400ml
/ Other special and custom sizes are available upon request

TYPICAL APPLICATION

/ Between CPU and heat sink
/ Between a component and heat sink
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ Mobile devices
/ 5G base station & infrastructure
/ EV electric vehicle

TYPICAL PROPERTIES

PROPERTY D2000 TEST METHOD UNIT
Color White-A Gray-B Visual -
Solid content Two-part : 100:100 - -
Viscosity A 95 ISO 3219 Pa.s
Viscosity B 95 ISO 3219 Pa.s
Density 2.8 ASTM D792 g/cm³
Shelf life 24 months - -
Hardness (AFTER CURE) 75 ASTM D2240 Shore OO
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 2.0 ASTM D5470 W/m*K
Thermal impedance@2mils BLT 0.042 ASTM D5470 °C-in²/ W

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