液体
シート
吸収
テープ
絶縁
黒鉛
軽量
断熱
低密度導熱膠泥 ——
CATEGORY
FEATURES
/ Lightweight, Low Density Thermal Conductivity: 10.0 W/m*K
/ High flow rate, extrusion rate under 90psi&60s conditions:55 g/min
/ Bond line thickness:100-1500µm
/ Designed to remove manufacturing tolerances
/ Does not produce stress on delicate components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression and low stress application
VERTICAL RELIABILITY
Using 1.5mm pad as a gap control, put the putty between the aluminum and the glass panel mark the initial position. Then, place it in the oven with 125℃ for 1,000 hours and observe its displacement after reliability test
TYPICAL APPLICATION
/ lightweight applications, such as Automotive electronic devices, Mobile communication device, Drone & aircraft, Sports and leisure electronic products, Portable computers and tablets, wearable devices, Portable game consoles, VR devices and etc.
TYPICAL PROPERTIES
| PROPERTY | DTT10-s | TEST METHOD | UNIT |
|---|---|---|---|
| Color | Pink | Visual | - |
| Resin base | Silicone | - | - |
| Viscosity | 5000 | DIN 53018 | Pa.s |
| Flow Rate | 55 | By LiPOLY | g/min |
| Density | 2.6 | ASTM D792 | g/cm³ |
| Application temperature | -60~150 | - | °C |
| Bond line thickness | 100~1500 | - | μm |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 10.0 | ASTM D5470 | W/m*K |
| Thermal impedance@10psi / 60°C | 0.041 | ASTM D5470 | °C-in²/ W |
| Thermal impedance@50psi / 60°C | 0.035 | ASTM D5470 | °C-in²/ W |