RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
導熱矽膠片(Thermal Pad)是一種介於發熱元件與散熱器之間,用來降低熱阻、提升散熱效率的軟性或剛性介面材料。它能填補兩種接觸面間的縫隙、排除空氣,以便將熱量有效傳遞並散逸至散熱器或外部空間。
PK404
4.0 W/m*K
PK404熱傳導係數:4.0 W / m*K的間隙填充材料。硬度Shore OO/30具有柔韌性、壓縮性、絕緣性、自黏性佳,可填補機構設計的正負公差,顯示出高穩定的特性,可客製化裁切沖型。

CATEGORY

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Thermal Putty

FEATURES

/ Thermal conductivity: 4.0 W/m*K
/ Naturally tacky for ease of manufacture
/ Low thermal impedance
/ Available in a range of thicknesses

SPECIFICATIONS

/ Roll form
/ Sheet form
/ Die-cut parts

TYPICAL APPLICATION

/ Notebook computers
/ Heat pipe assemblies
/ Memory modules
/ TV hardware
/ Automotive electronics
/ Mobile devices
/ High speed mass storage drives
/ Set-top box
/ IP CAM
/ 5G base station & infrastructure
/ EV electric vehicle

TYPICAL PROPERTIES

PROPERTY PK404 TEST METHOD UNIT
Color Blue Visual -
Surface tack 2-side/1-side 2 - -
Thickness Customized ASTM D374 mm
Density 2.8 ASTM D792 g/cm³
Hardness 30 ASTM D2240 Shore OO
Application temperature -60~180 - °C
Dielectric breakdown 12 ASTM D149 KV/mm
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 4.0 ASTM D5470 W/m*K
Thermal impedance@10 psi 0.502 ASTM D5470 °C-in²/ W
Thermal impedance@50 psi 0.361 ASTM D5470 °C-in²/ W

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