液態
墊片
吸波
膠帶
絕緣
石墨
輕量
斷熱
超軟導熱墊片 ——
BS75K
3.0 W/m*K
ShoreOO 18
BS75K是具有極高柔軟度的超軟導熱矽膠片，可避免PCB等零部件在安裝時因擠壓而造成變形，可充分填補機構設計的正負公差。BS75K 熱傳導係數 3.0W / m*K，硬度Shore OO 18，具有高柔軟性、高壓縮性、高絕緣、自黏性佳，可客製化裁切沖型，滿足客戶在面對今日先進產品上特殊的需求。
CATEGORY
FEATURES
/ Thermal conductivity: 3.0 W/m*K
/ High compression rate
/ Low thermal impedance
/ High recovery
/ Available in a range of thicknesses
SPECIFICATIONS
/ Roll form
/ Sheet form
/ Die-cut parts
TYPICAL APPLICATION
/ Between CPU and heat sink
/ Between a component and heat sink
/ Notebook computers
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | BS75K | TEST METHOD | UNIT |
|---|---|---|---|
| Color | Dark Gray | Visual | - |
| Surface tack 2-side/1-side | Customized | - | - |
| Thickness | Customized | ASTM D374 | mm |
| Density | 2.6 | ASTM D792 | g/cm³ |
| Hardness | 18 | ASTM D2240 | Shore OO |
| Application temperature | -60~180 | - | °C |
| Dielectric breakdown | 12 | ASTM D149 | KV/mm |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 3.0 | ASTM D5470 | W/m*K |
| Thermal impedance@10 psi | 0.562 | ASTM D5470 | °C-in²/ W |
| Thermal impedance@50 psi | 0.463 | ASTM D5470 | °C-in²/ W |