RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
NT92-s
2 W/m*K
NT92-s 採用非矽型樹脂材料作成,無低分子矽氧烷揮發,是同時具有導熱及吸收電磁波功能的複合性墊片,熱傳導係數:2.0 W / m*K的間隙填充材料,應用頻率範圍10MHz-77GHz,具有柔韌性、壓縮性,可客製化裁切沖型, 旭立專業的研發能力,可即時提供尖端的發熱解決方案,以滿足客戶在面對今日先進產品上特殊的需求。 何謂低分子矽氧烷?

CATEGORY

Thermal Putty

FEATURES

/ Thermal conductivity: 2.0 W/m*K
/ Excellent absorption characteristics
/ Naturally tacky
/ Reworkable

SPECIFICATIONS

/ Sheet form
/ Die-cut parts

TYPICAL APPLICATION

/ IC, CPU, MOS, LED, M/B, Heat sink
/ LCD-TV, Notebook PC, PC, Telecom device, Wireless hub
/ DDR II module, DVD applications, Hand-set applications
/ 5G base station & infrastructure
/ EV electric vehicle

/ 2.4 GHz Wi-Fi Router , Bluetooth
/ 3.5 GHz 5G Mobile Networks
/ 5.0 GHz Wi-Fi Router
/ 6.0 GHz Wi-Fi Router
/ 12~18 GHz Low Earth Orbit (LEO) System
/ 28 GHz 5G Mobile Networks
/ 39 GHz 5G Mobile Networks

TYPICAL PROPERTIES

PROPERTY NT92-s TEST METHOD UNIT
Color 2.0 Visual -
Surface tack 2-side/1-side 2 - -
Thickness Customized ASTM D374 mm
Density 4.2 ASTM D792 g/cm³
Hardness 60 ASTM D2240 Shore OO
Application temperature -60~125 - °C
Surface resistivity >10¹⁰ ASTM D257 Ohm
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 2.0 ASTM D5470 W/m*K
Thermal impedance@10 psi 1.091 ASTM D5470 °C-in²/ W
Thermal impedance@50 psi 0.812 ASTM D5470 °C-in²/ W

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