RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
EP770-s電子灌封膠是保護電子元件與電路板的重要材料,透過將液態膠體澆灌並固化於電子組件之間,可填滿電子器件周圍空氣空間的縫隙,形成長期且有效的防護層,可達到防水、防潮、耐震、電氣絕緣和保護關鍵線束等多重效果。EP770-s無低分子矽氧烷揮發,不會造成電器接點故障,適合光學產品或敏感的電子原件使用。
TPS31
0.55 W/m*K

電子灌膠 TPS31是一款低密度電子灌封材料。透過將膠體澆灌並固化於電子組件之間,形成長期且有效的防水、電氣絕緣和保護等多重效果。用於普通灌封、電源模塊灌封、各類傳感氣灌封等。

CATEGORY

Thermal Putty

FEATURES

/ Lightweight, Low Density, Thermal Conductivity 0.55 W/m*K
/ Medium-to-high hardness silicone material with excellent insulation and weather resistance
/ Suitable for automatic dispensing machine
/ TPS31 Moisture absorb hardening reaction at room temperature.

/// It can be preserved for 60 months under the condition of unopened and under room temperature 25°C.

TYPICAL APPLICATION

/ Heat Dissipation & lightweight applications, such as Automotive electronic devices, Mobile communication device, Drone & aircraft, Sports and leisure electronic products, Portable game consoles, VR devices and etc.
/ 5G base station & infrastructure
/ EV electric vehicle

TYPICAL PROPERTIES

PROPERTY TPS31 TEST METHOD UNIT
Color White(A) / Translucent(B) Visual -
Resin Base Silicone - -
Viscosity 1.9 ISO 3219 Pa.s
Density 1.35 ASTM D792 g/cm³
Application temperature -60~180 - °C
Working Time 25°C/30 min By LiPOLY -
Hardness 55 ASTM D2240 Shore A
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 0.55 ASTM D5470 W/m*K
Dielectric breakdown 10 ASTM D149 KV/mm
Volume resistivity >10¹³ ASTM D257 Ohm-m

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