液体
シート
吸収
テープ
軽量
絶縁
黒鉛
断熱
非シリコーン・熱伝導製品 ——
/ Lightweight, Low Density, Thermal Conductivity: 10.0 W/m*K
/ High flow rate, extrusion rate under 90psi&60s conditions: 20g/min
/ Bond line thickness:100~1500µm
/ Non-silicone resin materials
/ Designed to remove manufacturing tolerances
/ Does not produce stress on delicate components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression and low stress application
sing 1.5mm pad as a gap control, put the putty between the aluminum and the glass panel mark the initial position. Then, place it in the oven with 125℃ for 1,000 hours and observe its displacement after reliability test
/ lightweight applications, such as Automotive electronic devices, Mobile communication device, Drone & aircraft,Sports and leisure electronic products, Portable computers and tablets,wearable devices, Portable game consoles, VR devices and etc.
特性項目 | NL-putty10-s | 単位 | 測定基準 |
---|---|---|---|
外観色 | Red | - | Visual |
ベースポリマー | Non-Silicone | - | - |
粘度 | 10000 | Pa.s | DIN 53018 |
体積流量 | 20 | g/min | By LiPOLY |
比重 | 2.6 | g/cm³ | ASTM D792 |
使用温度範囲 | -60~125 | °C | - |
BLT(塗布厚み) | 100~1500 | μm | - |
ROHS & REACH | 対応 | - | - |
伝熱特性 | |||
熱伝導率 | 10.0 | W/m*K | ASTM D5470 |
熱抵抗@10psi / 80°C | 0.043 | °C-in²/ W | ASTM D5470 |
熱抵抗@50psi / 80°C | 0.036 | °C-in²/ W | ASTM D5470 |