RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
矽膠散熱帽套(Thermal Silicone Cap)是一種以矽膠為基材,兼具導熱與絕緣特性的套管式產品,常用於各類半導體元件(如電晶體、二極體、三極管)的封裝散熱。
HC-93
2.5 W/m*K

矽膠散熱帽套(Thermal Silicone Cap)是一種以矽膠為基材,兼具導熱與絕緣特性的套管式產品,常用於各類半導體元件(如電晶體、二極體、三極管)的封裝散熱。

Rubber Cap HC-93 是立體導熱絕緣矽橡膠帽,通過特殊的生產過程。由於其優良的導熱性、絕緣性、防震,組裝方便,廣泛用於熱晶體管參考 TO220 / TO3P。

CATEGORY

Thermal Putty

FEATURES

/ Thermal conductivity: 2.5 W/m*K
/ Good insulator
/ High recovery
/ Easy to assemble
/ Available in a range of thicknesses

SPECIFICATIONS (LxWxH)

/ 11.4mm x 16.0mm x 5.8mm
/ 11.4mm x 21.5mm x 5.8mm
/ 17.5mm x 28.5mm x 5.8mm

TYPICAL APPLICATION

/ Between CPU and heat sink
/ Between a component and heat sink
/ Notebook computers
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ 5G base station & infrastructure
/ EV electric vehicle

TYPICAL PROPERTIES

PROPERTY HC-93 TEST METHOD UNIT
Color Gray Visual -
Resin base Silicone - -
Thickness 0.30 | 0.45 ASTM D374 mm
Density 2.3 ASTM D792 g/cm³
Hardness 65 ASTM D2240 Shore A
Application temperature -60~180 - °C
Dielectric breakdown 7 | 8 ASTM D149 KV
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 2.5 ASTM D5470 W/m*K
Thermal impedance@10 psi 0.830 ASTM D5470 °C-in²/ W
Thermal impedance@50 psi 0.462 ASTM D5470 °C-in²/ W

聯絡我們


    熱介面管理專家

    旭立科技股份有限公司

    桃園市八德區永豐路435號

    CONTACT