RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
AS02-s
4.5 W/m*K
Thickness 0.15 / 2.0 mm
AS02-s是一種具有雙面粘性、低熱阻和高導熱性的材料。它具有優異的抗壓強度特性和良好的電氣隔離功能,適用於高功率電子元件,使其成為薄型設計安裝的最佳選擇。可提供定制的模切和成型服務。

CATEGORY

Thermal Putty

FEATURES

/ Great thermal conductivity
/ Low thermal impedance
/ High compressibility
/ Excellent elasticity
/ Suitable for high performance products
/ Die-cut part

SPECIFICATIONS

/ Roll form
/ Sheet form
/ Die-cut parts

TYPICAL APPLICATION

/ Electronic Components – Notebookcomputers, Heat pipe assemblies, Memory modules, TV hardware, Automotive electronics, Mobile devices, HPC , servers 5G base station & infrastructure, EV electric vehicle

TYPICAL PROPERTIES

PROPERTY AS02-s TEST METHOD UNIT
Color Green Visual -
Thickness 0.15 | 0.20 mm ASTM D374 mm
Thickness 0.0059 | 0.0079 in ASTM D374 inch
Volume resistivity 1x10¹² ASTM D257 Ohm -m
Elongation 10 ASTM D412 %
Weight loss <1 By LiPOLY %
Application temperature -50~180 - °C
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 4.5 | 4.5 ASTM D5470 W/m*K
Thermal impedance@10 psi 0.181 | 0.266 ASTM D5470 °C-in²/ W
Thermal impedance@50 psi 0.128 | 0.151 ASTM D5470 °C-in²/ W

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