RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
BS系列是超軟又有回彈性的導熱凝膠片,具有極佳的應力應變性,可避免安裝應力對PCB等零部件變形,熱傳導係數:5.0W / m*K的間隙填充材料。硬度Shore OO/10-25具有高柔軟性、高壓縮性、高絕緣、自黏性佳,可填補機構設計的正負公差,顯示出高穩定的特性,可客製化裁切沖型,可以滿足客戶在面對今日先進產品上特殊的需求。
BS89
5.0 W/m*K
ShoreOO 25

BS系列是超軟又有回彈性的超軟導熱凝膠片,具有極佳的應力應變特性,可避免安裝時產生的應力對PCB等零部件變形。BS89 熱傳導係數 5.0W / m*K,硬度Shore OO 25具有高柔軟性、高壓縮性、高絕緣、自黏性佳,可填補機構設計的正負公差、可客製化裁切沖型,滿足客戶在面對今日先進產品上特殊的需求。

CATEGORY

Thermal Putty

FEATURES

/ Thermal conductivity: 5.0 W/m*K
/ High compression rate
/ Low thermal impedance
/ High recovery
/ Available in a range of thicknesses

SPECIFICATIONS

/ Roll form
/ Sheet form
/ Die-cut parts

TYPICAL APPLICATION

/ Between CPU and heat sink
/ Between a component and heat sink
/ Notebook computers
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ 5G base station & infrastructure
/ EV electric vehicle

TYPICAL PROPERTIES

PROPERTY BS89 TEST METHOD UNIT
Color Gray Visual -
Surface tack 2-side/1-side 2 - -
Thickness Customized ASTM D374 mm
Density 3.0 ASTM D792 g/cm³
Hardness 25 ASTM D2240 Shore OO
Application temperature -60~180 - °C
Dielectric breakdown 12 ASTM D149 KV/mm
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 5.0 ASTM D5470 W/m*K
Thermal impedance@10 psi 0.318 ASTM D5470 °C-in²/ W
Thermal impedance@50 psi 0.194 ASTM D5470 °C-in²/ W

聯絡我們


    熱介面管理專家

    旭立科技股份有限公司

    桃園市八德區永豐路435號

    CONTACT