製品特性
/ Thermal conductivity: 24.0 W/m*K
/ High compression rate
/ Extremely low thermal impedance
Configurations
// Sheets form
// Die-cuts parts
NEW Product
/ Thermal conductivity: 24.0 W/m*K
/ High compression rate
/ Extremely low thermal impedance
// Sheets form
// Die-cuts parts
/ Between CPU and heat sink
/ Between a component and heat sink
/ Flat-panel displays
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ 5G base station & infrastructure
/ High-end Chip
特性項目 | T-top99-s 超高導熱墊片 | 測定基準 | 単位 |
---|---|---|---|
外観色 | Gray | Visual | - |
表面タック構成 [片面/両面] | 2 | - | - |
厚さ | Customized | ASTM D374 | mm |
比重 | 3.3 | ASTM D792 | g/cm³ |
硬さ | 70 | ASTM D2240 | Shore OOO |
TML | <0.1 | By LiPOLY | % |
使用温度範囲 | -60~150 | - | °C |
ROHS & REACH | 対応 | ||
伝熱特性 | |||
熱伝導率 | 24.0 | ASTM D5470 | W/m*K |
熱伝導率 | 15.0 | ISO 22007-2 | W/m*K |
Thermal impedance@10psi | 0.085 | ASTM D5470 | ° C-in²/ W |