RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
N800BH-s
11.0 W/m*K
Low Outgassing
N800BH-s採用非矽型樹脂材料作成,無低分子矽氧烷揮發,不會造成電器接點故障,適合光學產品或敏感的電子原件使用。熱傳導係數:11.0 W / m*K的間隙填充材料。硬度Shore OO/50具有良好的導熱性,呈現出最低的熱阻值,尤其是N800C熱傳導係數高達17.0 W / m*K。旭立專業的研發能力,可即時提供尖端的發熱解決方案,以滿足客戶在面對今日先進產品上特殊的需求。

CATEGORY

Thermal Putty

FEATURES

/ Thermal conductivity:11.0 W/m*K
/ It’s made by non-silicone resin materials
/ Low contact thermal resistance
/ With electrical insulation
/ Outstanding thermal conductivity
/ Applicable to optical and sensitive electric components

SPECIFICATIONS

/ Sheet form
/ Die-cut parts

TYPICAL APPLICATION

/ HDDS
/ Optical appliance
/ 5G base station & infrastructure
/ EV electric vehicle

TYPICAL PROPERTIES

PROPERTY N800BH-s TEST METHOD UNIT
Color Pink Visual -
Surface tack 2-side/1-side 2 - -
Thickness Customized ASTM D374 mm
Density 3.3 ASTM D792 g/cm³
Hardness 50 ASTM D2240 Shore OO
Tensile Strength 0.15 ASTM D412 Kgf/cm²
Outgassing CVCM (wt%) 0.0047 By LiPOLY -
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 11.0 ASTM D5470 W/m*K
Thermal impedance@10 psi 0.210 ASTM D5470 °C-in²/ W
Thermal impedance@30 psi 0.088 ASTM D5470 °C-in²/ W

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    熱介面管理專家

    旭立科技股份有限公司

    桃園市八德區永豐路435號

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