FEATURES
/ Thermal conductivity: 5.0 W/m*K
/ Hardness: Shore OO/55
/ Low dielectric constant
/ For high frequency applications
/ Available in a range of thicknesses
SPECIFICATIONS
/ Sheet form
/ Die-cut parts
NEW Product
DTT65-s 導熱低密度系列
LiPOLY DTT65-s 導熱矽膠片是一款柔軟的導熱凝膠，特別針對網路通訊應用而設計。DTT65-s 著重於介電常數(Dk)與介質損耗(Df)，以降低RF模組中的干擾。其導熱係數達 5.0 W/m*K。此產品可提供標準片材、客製化裁切或客製化模塑，適用於各種廣泛的應用場合。
TYPICAL APPLICATION
/ 5G system devices
/ Communications satellite
/ Satellite positioning devices
/ IoT devices
/ Telecommunication hardware
TYPICAL PROPERTIES
| PROPERTY | DTT65-s 導熱低密度系列 | TEST METHOD | UNIT |
|---|---|---|---|
| Color | Red | Visual | - |
| Surface tack 2-side/1-side | 2 | - | - |
| Thickness | Customized | ASTM D374 | mm |
| Density | 2.1 | ASTM D792 | g/cm³ |
| Hardness | 55 | ASTM D2240 | Shore OO |
| Water absorption | 0.005 | ASTM D570 | % |
| Application temperature | -60~180 | - | °C |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 5.0 | ASTM D5470 | W/m*K |
| Thermal impedance@10 psi | 0.350 | ASTM D5470 | °C-in²/ W |
| Thermal impedance@50 psi | 0.281 | ASTM D5470 | °C-in²/ W |
