{"id":576,"count":1,"description":"Ultra-high thermal conductivity pads offer excellent thermal performance, compressibility, and conformability. They effectively fill gaps between heat-generating components and cooling modules, making them suitable for thermal management in AI servers, GPUs, CPUs, power modules, and other high-power electronic equipment.","link":"https:\/\/lipoly.com\/en\/product-category\/gap-filler\/thermal-gel-pad\/ultra\/","name":"Ultra High Thermal Conductive Pad","slug":"ultra","taxonomy":"product_cat","parent":149,"meta":[],"acf":[],"_links":{"self":[{"href":"https:\/\/lipoly.com\/en\/wp-json\/wp\/v2\/product_cat\/576","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/lipoly.com\/en\/wp-json\/wp\/v2\/product_cat"}],"about":[{"href":"https:\/\/lipoly.com\/en\/wp-json\/wp\/v2\/taxonomies\/product_cat"}],"up":[{"embeddable":true,"href":"https:\/\/lipoly.com\/en\/wp-json\/wp\/v2\/product_cat\/149"}],"wp:post_type":[{"href":"https:\/\/lipoly.com\/en\/wp-json\/wp\/v2\/product?product_cat=576"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}