{"id":142,"count":3,"description":"<p class=\"font-claude-response-body break-words whitespace-normal leading-[1.7]\">Thermal die attach adhesive is a critical bonding material for AI chips and semiconductor packaging, securing dies to substrates and supporting subsequent packaging processes. As AI chip computing density continues to rise, its excellent gap-filling properties and heat-cure characteristics effectively reduce junction temperatures, making it an essential thermal management material for high-performance computing systems. Available in multiple types based on conductivity and curing method, it performs reliably in AI server immersion cooling, EV, and high-power module applications \u2014 maintaining stable thermal conductivity under prolonged thermal cycling and high-load conditions to meet the demanding heat dissipation requirements of advanced electronics and automotive applications.<\/p>","link":"https:\/\/lipoly.com\/en\/product-category\/liquid-gap-fillers\/two-part\/die-attach-adhesive\/","name":"Die-attach","slug":"die-attach-adhesive","taxonomy":"product_cat","parent":139,"meta":[],"acf":[],"_links":{"self":[{"href":"https:\/\/lipoly.com\/en\/wp-json\/wp\/v2\/product_cat\/142","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/lipoly.com\/en\/wp-json\/wp\/v2\/product_cat"}],"about":[{"href":"https:\/\/lipoly.com\/en\/wp-json\/wp\/v2\/taxonomies\/product_cat"}],"up":[{"embeddable":true,"href":"https:\/\/lipoly.com\/en\/wp-json\/wp\/v2\/product_cat\/139"}],"wp:post_type":[{"href":"https:\/\/lipoly.com\/en\/wp-json\/wp\/v2\/product?product_cat=142"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}