{"id":138,"count":7,"description":"Thermal putty is a material designed for efficient heat conduction, primarily used to fill gaps between PCB components and heat sinks, ensuring effective heat transfer and preventing overheating. It is commonly used in thermal management for electronic components. As a high thermal conductivity material, it can fill uneven surfaces and remain fixed long-term without peeling off, making it the best choice for larger gap applications.","link":"https:\/\/lipoly.com\/en\/product-category\/liquid-gap-fillers\/thermal-putty\/","name":"Thermal Putty","slug":"thermal-putty","taxonomy":"product_cat","parent":82,"meta":[],"acf":[],"_links":{"self":[{"href":"https:\/\/lipoly.com\/en\/wp-json\/wp\/v2\/product_cat\/138","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/lipoly.com\/en\/wp-json\/wp\/v2\/product_cat"}],"about":[{"href":"https:\/\/lipoly.com\/en\/wp-json\/wp\/v2\/taxonomies\/product_cat"}],"up":[{"embeddable":true,"href":"https:\/\/lipoly.com\/en\/wp-json\/wp\/v2\/product_cat\/82"}],"wp:post_type":[{"href":"https:\/\/lipoly.com\/en\/wp-json\/wp\/v2\/product?product_cat=138"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}