{"id":32093,"date":"2026-09-09T11:30:02","date_gmt":"2026-09-09T03:30:02","guid":{"rendered":"https:\/\/lipoly.com\/?p=32093"},"modified":"2026-09-11T10:46:36","modified_gmt":"2026-09-11T02:46:36","slug":"pcm900-thermal-interface-material-ai-gpu-module","status":"publish","type":"post","link":"https:\/\/lipoly.com\/en\/news\/tech\/pcm900-thermal-interface-material-ai-gpu-module\/","title":{"rendered":"AI GPU Module Thermal Challenges: The Full Picture, and a Phase Change Material Solution"},"content":{"rendered":"<div data-elementor-type=\"wp-post\" data-elementor-id=\"32093\" class=\"elementor elementor-32093\" data-elementor-post-type=\"post\">\n\t\t\t\t<div class=\"elementor-element elementor-element-044ac9a e-flex e-con-boxed qodef-elementor-content-no e-con e-parent\" data-id=\"044ac9a\" data-element_type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-0a00a0a elementor-widget elementor-widget-heading\" data-id=\"0a00a0a\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">As AI GPU Module Power Density Rises, Every Heat Source Approaches Its Own Thermal Limit<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-d2c414c elementor-widget elementor-widget-text-editor\" data-id=\"d2c414c\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>An AI server GPU module is, in practice, a composite system built from several independent heat sources: the GPU compute die itself, HBM (High Bandwidth Memory) stacked within or beside the package, the VRM (voltage regulator module) that handles board-level power delivery, and AI Accelerators whose packaging closely resembles that of the GPU. Each of these components follows its own heat-dissipation path, packaging approach, and thermal design limit, yet all of them share the same underlying power-density growth curve of the module. Both the GPU die and the HBM stacks within the package rely on a chip-level thermal interface material (TIM-1 \u2014 the interface material between the die and the vapor chamber\/cold plate) to carry heat away; the long-term reliability of this material directly determines whether the chip can stay within a safe junction-temperature range.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-34e1b33 elementor-widget elementor-widget-text-editor\" data-id=\"34e1b33\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>This article first surveys the thermal challenges facing the main heat sources inside an AI GPU module, as background for understanding the system-level picture. It then focuses specifically on the GPU's own chip-level TIM, covering the known limitations of conventional thermal grease and the technical specifications and reliability data of LiPOLY's PCM900 phase change material.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-b450737 elementor-widget elementor-widget-heading\" data-id=\"b450737\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Main Heat Sources in an AI GPU Module and Their Respective Thermal Challenges<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-999eb49 elementor-widget elementor-widget-text-editor\" data-id=\"999eb49\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Before turning to TIM materials, it helps to clarify what each major heat source inside the module is dealing with \u2014 this explains why thermal design has become a core variable in overall AI server architecture.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-9338264 blog__editor elementor-widget elementor-widget-text-editor\" data-id=\"9338264\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<ul><li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"color: #0061d4;\"><b>GPU compute die:<\/b><\/span><span style=\"font-weight: 400;\">AI server GPUs operate differently from traditional data-center workloads. During model training, GPUs often run at near-full load continuously for days at a time, keeping junction temperatures elevated for extended periods.<br \/><\/span><\/li><li><span style=\"color: #0061d4;\"><b>HBM (High Bandwidth Memory):<\/b><\/span><span style=\"font-weight: 400;\">As GPU and HBM integration moves toward 3D stacking, vertical thermal resistance has become a new challenge. Research presented by imec, Belgium's microelectronics research center, at the 2025 IEEE International Electron Devices Meeting (IEDM) found that in a 3D HBM-on-GPU architecture without any thermal mitigation, peak GPU temperature under AI training workloads can reach 141.7\u00b0C \u2014 far beyond the operable range; combined technology- and system-level optimization is needed to bring peak temperature down to 70.8\u00b0C, on par with current 2.5D integration. This indicates that HBM's thermal bottleneck stems primarily from the vertical thermal resistance inherent to the packaging architecture \u2014 a packaging- and system-level issue.<br \/><\/span><\/li><li><span style=\"color: #0061d4;\"><b>VRM (voltage regulator module):<\/b><\/span><span style=\"font-weight: 400;\">Board-level power delivery in an AI GPU module also has to manage heat generated under high current. Industry technical analysis notes that VRM circuit PCB design \u2014 heavy-copper power planes, low-inductance routing, and high-density decoupling capacitor arrays \u2014 is among the most demanding aspects of GPU baseboard design, requiring thermal and current-carrying capacity to be considered together.<\/span><\/li><li><span style=\"color: #0061d4;\"><b>AI Accelerator\uff1a<\/b><\/span><span style=\"font-weight: 400;\">Whether GPU-based or built on another architecture, an AI Accelerator's chip packaging closely resembles that of a GPU \u2014 it likewise integrates a compute die, memory stacks, power-management ICs, and a chip-level thermal interface material, and faces thermal challenges highly similar to those of a GPU.<\/span><\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-1d67fe5 elementor-widget elementor-widget-text-editor\" data-id=\"1d67fe5\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><span style=\"font-weight: 400;\">While these four component types together make up the full thermal picture of an AI GPU module, the interface-material selection considerations for each differ (for example, HBM's packaging structure and VRM's board-level heat path are both distinct from the application context of GPU chip-level TIM). The remainder of this article focuses specifically on the GPU's own chip-level TIM (TIM-1).<\/span><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-4b407e9 elementor-widget elementor-widget-heading\" data-id=\"4b407e9\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">The Real Consequence of Chip-Level TIM Degradation: Throttling and Performance Loss<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-58ffa10 elementor-widget elementor-widget-text-editor\" data-id=\"58ffa10\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><span style=\"font-weight: 400;\">When a chip-level TIM's thermal resistance degrades over time, the consequence is not merely a rising temperature reading \u2014 it shows up directly in GPU compute performance. Industry analysis notes that once a high-end GPU's junction temperature reaches the critical 85\u201390\u00b0C threshold, the hardware initiates thermal throttling, automatically reducing clock frequency to prevent damage; a cluster running in a throttled state can lose up to 25% of its theoretical maximum performance \u2014 a meaningful increase in both runtime and cost for large language model training jobs that can span weeks. Academic research offers a concrete, quantified example: a paper on health management for large-scale training clusters found that as GPU temperature rises from 50\u00b0C to 77\u00b0C, core clock frequency can drop from 1.93 GHz to 1.38 GHz, noticeably delaying synchronization-sensitive training steps. These figures reflect a general industry pattern relating GPU junction temperature to performance, rather than test results for any specific TIM material \u2014 but they illustrate why chip-level TIM reliability is a variable that design teams must take seriously, rather than a simple spec-sheet comparison.<\/span><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-ab835d6 elementor-widget elementor-widget-heading\" data-id=\"ab835d6\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Known Limitations of Conventional Thermal Grease in Chip-Level TIM Applications<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-8f367f5 elementor-widget elementor-widget-text-editor\" data-id=\"8f367f5\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><span style=\"font-weight: 400;\">Conventional thermal grease has long been the mainstream choice for chip-level TIM, offering low initial thermal resistance and ease of application. However, comparative academic studies have found that thermal grease is prone to dry-out, pump-out, and increased void formation under prolonged thermal and power cycling \u2014 degradation that raises interface thermal resistance over time. Because phase change materials (PCMs) eliminate the dispensing and drying steps altogether, they are less prone to these voiding, pump-out, and interfacial-delamination issues.<\/span><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-7ad7c85 elementor-widget elementor-widget-heading\" data-id=\"7ad7c85\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">How Phase Change Materials Address This Challenge: Working Principle and Physical Basis<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-448f364 elementor-widget elementor-widget-text-editor\" data-id=\"448f364\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><span style=\"font-weight: 400;\">A phase change material remains solid at room temperature, which makes it easy to handle in automated assembly and in transport and storage. Once temperature rises above its phase-change point, it softens into a semi-solid state that flows to conform to the microscopic surface irregularities between the heat source and the heat sink, lowering interface thermal resistance. Interface thermal resistance can be understood approximately through R \u2248 BLT \u00f7 k, where BLT (Bond Line Thickness) is the thickness of the material once actually applied, and k is the material's thermal conductivity; for a given k, a thinner BLT means lower thermal resistance. This is why chip-level TIM specifications place particular emphasis on \"the minimum achievable BLT,\" rather than simply comparing thermal conductivity figures \u2014 for chip-level applications where the gap between the die and the vapor chamber may be only tens of microns, whether a material can conform to a sufficiently thin BLT often has a more direct impact on final thermal resistance than a high thermal conductivity figure alone.<\/span><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-74f09a8 elementor-widget elementor-widget-text-editor\" data-id=\"74f09a8\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><span style=\"font-weight: 400;\">It is worth noting that academic literature has also found that phase change materials engineered for higher thermal conductivity through significantly increased filler loading can carry an elevated risk of leakage and mechanical failure. This is a general technical consideration for the phase change material category as a whole, not a result specific to any one product; it is included here purely as background, and product selection should still be based on the reliability test data of the individual product in question.<\/span><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-6fecf61 elementor-widget elementor-widget-heading\" data-id=\"6fecf61\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">PCM900 Technical Specifications<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-73694e8 elementor-widget elementor-widget-text-editor\" data-id=\"73694e8\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>LiPOLY PCM900 is a phase change material engineered for chip-level applications. It remains solid at room temperature for easy automated assembly, and softens and conforms once heated to a phase-change point of approximately 45\u00b0C. Published catalog specifications are as follows:<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-4a5fadb elementor-widget elementor-widget-text-editor\" data-id=\"4a5fadb\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<div class=\"editor__table-wrap\"><table class=\"editor__table\"><thead><tr><th>Property<\/th><th>Value<\/th><th>TEST METHOD<\/th><\/tr><\/thead><tbody><tr><td>Thermal conductivity<\/td><td>9.0 W\/m\u00b7K<\/td><td>ASTM D5470<\/td><\/tr><tr><td>Phase Change Temperature<\/td><td>45\u00b0C<\/td><td>&#8211;<\/td><\/tr><tr><td>Minimum Bond Line Thickness (BLT)<\/td><td>24 \u00b5m<\/td><td>&#8211;<\/td><\/tr><tr><td>Application temperature<\/td><td>-60\uff5e150\u00b0C<\/td><td>&#8211;<\/td><\/tr><tr><td>Density<\/td><td>2.70 g\/cm\u00b3<\/td><td>ASTM D792<\/td><\/tr><tr><td>Surface \/ Volume Resistivity<\/td><td>&gt;10\u00b9\u00b2 Ohm\uff0fOhm\u00b7m<\/td><td>ASTM D257<\/td><\/tr><\/tbody><\/table><\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-18300a4 elementor-widget elementor-widget-heading\" data-id=\"18300a4\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Frequently Asked Questions<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-320185a elementor-widget elementor-widget-heading\" data-id=\"320185a\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h3 class=\"elementor-heading-title elementor-size-default\">Q1: What are PCM900\u2019s advantages compared with conventional thermal grease?<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-0e27068 elementor-widget elementor-widget-text-editor\" data-id=\"0e27068\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><span style=\"font-weight: 400;\">PCM900 remains solid at room temperature and can go straight into automated pick-and-place assembly, eliminating the dispensing, degassing, and drying steps required for conventional thermal grease. Comparative academic studies note that because phase change materials skip the dispensing and drying process entirely, they are less prone to the dry-out and pump-out degradation commonly seen with conventional thermal grease over the long term.<\/span><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-8aa0ed6 elementor-widget elementor-widget-heading\" data-id=\"8aa0ed6\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h3 class=\"elementor-heading-title elementor-size-default\">Q2: What is the practical significance of the 45\u00b0C phase-change temperature?<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-cedfe85 elementor-widget elementor-widget-text-editor\" data-id=\"cedfe85\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><span style=\"font-weight: 400;\">PCM900 stays solid below 45\u00b0C, making it easy to cut, transport, and place with automated equipment. Once the chip powers on and the interface temperature rises above 45\u00b0C, the material softens and flows to conform to the microscopic surface irregularities between the heat source and the vapor chamber, reaching the catalog's minimum 24 \u00b5m bond line thickness (BLT) \u2014 balancing ease of assembly with low contact thermal resistance.<\/span><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-f7e8a9a elementor-widget elementor-widget-heading\" data-id=\"f7e8a9a\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h3 class=\"elementor-heading-title elementor-size-default\">Q3: Has PCM900's reliability been validated through long-term testing?<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-9528890 elementor-widget elementor-widget-text-editor\" data-id=\"9528890\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><span style=\"font-weight: 400;\">Yes. The catalog reports four reliability tests \u2014 thermal aging (125\u00b0C), high-temperature\/high-humidity (85\u00b0C\/85% RH HAST), thermal cycling (-40 to 125\u00b0C), and low-temperature exposure (-60\u00b0C) \u2014 run for as long as 1,000 hours or 500 cycles. Across all four, the change in thermal resistance stays within roughly 10% of the original value, indicating stable interface performance under sustained thermal stress.<\/span><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-eff0a74 elementor-widget elementor-widget-heading\" data-id=\"eff0a74\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h3 class=\"elementor-heading-title elementor-size-default\">Q4: What applications is PCM900 suited for?<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-ce2273b elementor-widget elementor-widget-text-editor\" data-id=\"ce2273b\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><span style=\"font-weight: 400;\">Per the catalog's \"Typical Application\" listing, PCM900 is suited to AI\/HPC (AI servers, GPUs), data centers (servers, networking equipment), consumer electronics (PCs, SSDs, game consoles), power (power modules, power supplies), and automotive electronics (ECU, BMS, OBC), and is available in 0.15 mm, 0.20 mm, and 0.25 mm thicknesses to suit different applications.<\/span><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-ca3cb12 elementor-widget elementor-widget-heading\" data-id=\"ca3cb12\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h3 class=\"elementor-heading-title elementor-size-default\">LiPOLY PCM900 Product Overview<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-8ee6c11 elementor-widget elementor-widget-text-editor\" data-id=\"8ee6c11\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><span style=\"font-weight: 400;\">A high-performance phase change thermal interface material engineered for chip-level applications, with a thermal conductivity of 9.0 W\/m\u00b7K and a 45\u00b0C phase-change temperature, suited to AI server, GPU, and other AI\/HPC applications. Available in 0.15 mm, 0.20 mm, and 0.25 mm thicknesses, and can be supplied as roll, sheet, or die-cut format as required.<\/span><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-d2f9d10 elementor-widget elementor-widget-heading\" data-id=\"d2f9d10\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h6 class=\"elementor-heading-title elementor-size-default\">References<\/h6>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-734a356 blog__editor blog__source elementor-widget elementor-widget-text-editor\" data-id=\"734a356\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<ul style=\"list-style-type: square;\">\n \t<li><a href=\"https:\/\/www.nextpcb.com\/blog\/what-is-an-ai-server\" target=\"_blank\" rel=\"noopener\">NextPCB. &#8220;What Is an AI Server? Architecture, Components &amp; PCB Requirements.&#8221; <\/a><\/li>\n \t<li><a href=\"https:\/\/www.nextpcb.com\/blog\/gpu-rack-architecture-ai-cluster\" target=\"_blank\" rel=\"noopener\">NextPCB. &#8220;GPU Rack Architecture: How AI Clusters Are Built from PCB to Rack.&#8221;<\/a><\/li>\n \t<li><a href=\"https:\/\/www.imec-int.com\/en\/press\/imec-mitigates-thermal-bottleneck-3d-hbm-gpu-architectures-using-system-technology-co\" target=\"_blank\" rel=\"noopener\">imec. &#8220;Imec Mitigates Thermal Bottleneck in 3D HBM-on-GPU Architectures.&#8221; Presented at IEEE International Electron Devices Meeting (IEDM), 2025.\u00a0<\/a><\/li>\n \t<li><a href=\"https:\/\/techround.co.uk\/artificial-intelligence\/hidden-bottleneck-ai-boom-thermal-throttling-slowing-down-gpus\/\" target=\"_blank\" rel=\"noopener\">TechRound. &#8220;The Hidden Bottleneck of the AI Boom: Why Thermal Throttling Is Slowing Down Your GPUs.&#8221;\u00a0<\/a><\/li>\n \t<li><a href=\"https:\/\/arxiv.org\/pdf\/2605.17879\" target=\"_blank\" rel=\"noopener\">arXiv. &#8220;Guard: Scalable Straggler Detection and Node Health Management for Large-Scale Training.&#8221;\u00a0<\/a><\/li>\n \t<li><a href=\"https:\/\/ieeexplore.ieee.org\/document\/9501810\/\" target=\"_blank\" rel=\"noopener\">IEEE Xplore. &#8220;A Comparison Study of TIM Degradation of Phase Change Material and Thermal Grease.&#8221;\u00a0<\/a><\/li>\n \t<li><a href=\"https:\/\/www.sciencedirect.com\/science\/article\/abs\/pii\/S0735193326005269\" target=\"_blank\" rel=\"noopener\">ScienceDirect. &#8220;Synergistically Reinforced Phase Change Thermal Interface Materials for High-Power Electronics: Low Resistance and Long-Term Reliability.&#8221;\u00a0<\/a><\/li>\n \t<li>LiPOLY Ultra3065 Product Datasheet (Chinese \/ English \/ Japanese) \u2014 Internal Specifications<\/li>\n<\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-74d9295e elementor-section-boxed elementor-section-height-default elementor-section-height-default qodef-elementor-content-no\" data-id=\"74d9295e\" data-element_type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-4259aeb8\" data-id=\"4259aeb8\" data-element_type=\"column\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;}\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t<div class=\"elementor-element elementor-element-781cae81 e-con-full e-flex qodef-elementor-content-no e-con e-parent\" data-id=\"781cae81\" data-element_type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-210b3294 elementor-widget elementor-widget-heading\" data-id=\"210b3294\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h4 class=\"elementor-heading-title elementor-size-default\">Related Products<\/h4>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-a1230c8 e-con-full pdlist e-flex qodef-elementor-content-no e-con e-child\" data-id=\"a1230c8\" data-element_type=\"container\">\n\t\t<div class=\"elementor-element elementor-element-71094cd pdlist__imgobx e-con-full e-flex qodef-elementor-content-no e-con e-child\" data-id=\"71094cd\" data-element_type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-1d9a10b pdlist__tag-non_silicone elementor-widget elementor-widget-text-editor\" data-id=\"1d9a10b\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Non-Silicone<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-ac42151 pdlist__tag-new elementor-widget elementor-widget-text-editor\" data-id=\"ac42151\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>NEW<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-4da9349 e-con-full pdlist-thermal e-flex qodef-elementor-content-no e-con e-child\" data-id=\"4da9349\" data-element_type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;,&quot;position&quot;:&quot;absolute&quot;}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-5318516 pdlist-thermal__num elementor-widget elementor-widget-heading\" data-id=\"5318516\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<span class=\"elementor-heading-title elementor-size-default\">9.0<\/span>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-54340ae pdlist-thermal__uni elementor-widget elementor-widget-heading\" data-id=\"54340ae\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<span class=\"elementor-heading-title elementor-size-default\"> W\/m\u00b7K<\/span>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-b3f9f4d productoverf elementor-widget elementor-widget-image\" data-id=\"b3f9f4d\" data-element_type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<a href=\"\/en\/product\/gap-filler\/thermal-pad\/phase-change-material\/pcm900\/\" target=\"_blank\">\n\t\t\t\t\t\t\t<img fetchpriority=\"high\" decoding=\"async\" width=\"650\" height=\"650\" src=\"https:\/\/lipoly.com\/wp-content\/uploads\/2026\/08\/pcm900_v4-650x650.png\" class=\"attachment-qi_blocks_image_size_square size-qi_blocks_image_size_square wp-image-31410\" alt=\"LiPOLY PCM900 is a high-performance Phase Change Material that remains solid at room temperature for easy handling and automated assembly. At approximately 45\u00b0C, it softens and conforms to microscopic gaps between the heat source and heat sink, effectively reducing thermal resistance and improving heat transfer efficiency. Formulated with advanced thermally conductive fillers and a reliable phase change matrix, PCM900 resists pump-out and dry-out, providing excellent long-term reliability while delivering thermal performance comparable to premium thermal greases. It offers a stable, efficient, and reliable thermal interface solution.\" srcset=\"https:\/\/lipoly.com\/wp-content\/uploads\/2026\/08\/pcm900_v4-650x650.png 650w, https:\/\/lipoly.com\/wp-content\/uploads\/2026\/08\/pcm900_v4-300x300.png 300w, https:\/\/lipoly.com\/wp-content\/uploads\/2026\/08\/pcm900_v4-150x150.png 150w, https:\/\/lipoly.com\/wp-content\/uploads\/2026\/08\/pcm900_v4-768x768.png 768w, https:\/\/lipoly.com\/wp-content\/uploads\/2026\/08\/pcm900_v4-12x12.png 12w, https:\/\/lipoly.com\/wp-content\/uploads\/2026\/08\/pcm900_v4-700x700.png 700w, https:\/\/lipoly.com\/wp-content\/uploads\/2026\/08\/pcm900_v4.png 800w\" sizes=\"(max-width: 650px) 100vw, 650px\" title=\"\">\t\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-e8eb491 e-con-full e-flex qodef-elementor-content-no e-con e-child\" data-id=\"e8eb491\" data-element_type=\"container\">\n\t\t<div class=\"elementor-element elementor-element-0af9af0 e-con-full e-flex qodef-elementor-content-no e-con e-child\" data-id=\"0af9af0\" data-element_type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-96c1f32 elementor-widget elementor-widget-heading\" data-id=\"96c1f32\" data-element_type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h3 class=\"elementor-heading-title elementor-size-default\"><a href=\"\/en\/product\/gap-filler\/thermal-pad\/phase-change-material\/pcm900\/\" target=\"_blank\">PCM900<\/a><\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-233d6e0 pdlist__tag-feature elementor-widget elementor-widget-text-editor\" data-id=\"233d6e0\" data-element_type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Phase Change Materials<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>","protected":false},"excerpt":{"rendered":"<p>Power density inside AI GPU modules keeps climbing, pushing the GPU, HBM, and VRM ever closer to their thermal design limits. This article focuses on GPU chip-level TIM, examining how PCM900 phase change material works and the reliability data behind it.<\/p>","protected":false},"author":6,"featured_media":32105,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[465],"tags":[586,584,581,585,582],"class_list":["post-32093","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-tech","tag-ai","tag-ai-gpu","tag-hbm","tag-vrm","tag-582"],"acf":[],"_links":{"self":[{"href":"https:\/\/lipoly.com\/en\/wp-json\/wp\/v2\/posts\/32093","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/lipoly.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/lipoly.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/lipoly.com\/en\/wp-json\/wp\/v2\/users\/6"}],"replies":[{"embeddable":true,"href":"https:\/\/lipoly.com\/en\/wp-json\/wp\/v2\/comments?post=32093"}],"version-history":[{"count":33,"href":"https:\/\/lipoly.com\/en\/wp-json\/wp\/v2\/posts\/32093\/revisions"}],"predecessor-version":[{"id":32135,"href":"https:\/\/lipoly.com\/en\/wp-json\/wp\/v2\/posts\/32093\/revisions\/32135"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/lipoly.com\/en\/wp-json\/wp\/v2\/media\/32105"}],"wp:attachment":[{"href":"https:\/\/lipoly.com\/en\/wp-json\/wp\/v2\/media?parent=32093"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/lipoly.com\/en\/wp-json\/wp\/v2\/categories?post=32093"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/lipoly.com\/en\/wp-json\/wp\/v2\/tags?post=32093"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}